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News Release
IR News

		Details

[Dec. 2, 2011]		Introducing the DAD3360 Automatic Dicing Saw with extended support for 300 mm wafers
[Nov. 28, 2011]		Introducing the DFG8830, a grinder with a 4-axis and 5-chuck table configuration for hard and brittle materials such as sapphire and SiC
[Nov. 25, 2011]		Earthquake in Hokkaido prefecture, Japan on November 24, 2011
[Nov. 24, 2011]		Introducing the energy saving DTU1540 Water Temperature Control Unit
		DISCO Has Developed Technology for Separating and Recovering Silicon Sludge from Grinder Wastewater

		Details

[Nov. 7, 2011]		Consolidated Financial Results for the Second Quarter of Fiscal Year 2011
		Notification of Revision to the Dividend Forecasts and Business Forecasts(Fiscal Year 2011)
		DISCO Announces a Dividend Payment for Fiscal Year 2010
		Presentation for FY2011 2Q Financial Results and FY2011 Forecast
[Oct. 27, 2011]		Preliminary Report on Consolidated Sales Figures and Non-Consolidated Earnings Results (Second Quarter of Fiscal Year 2011)
[Oct. 3, 2011]		Preliminary Report on Non-Consolidated Sales Figures (Second Quarter of Fiscal Year 2011)
[Aug. 15, 2011]		Top message has been updated.
[Aug. 10, 2011]		Annual Report 2011

DWR1720

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