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 IR
News |
| December 28, 2007 |
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2007年度客户满意度调查结果更新完毕。 |
| December 26, 2007 |
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“Discontinued Machines List” page has been updated. |
| December 25, 2007 |
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年末年初的销售日程安排 |
| December 20, 2007 |
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Will be displayed at 9th IC PACKAGING TECHNOLOGY EXPO has been added. |
| November 27, 2007 |
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Development of the Ultrathin Hub Blade ZHZZ Series to realize the 10 µm Kerf |
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Development of the ZHCR Series Reduces Tip Shape Collapse of Thick Blades |
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Development of the GS08 Series Realizes High-Quality Grinding of SiC |
| November 20, 2007 |
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Development of the New DGP8761 300 mm Wafer Fully Automatic Grinder/Polisher, the Newly Developed E PAD Stress Relief Polishing Pad, and the New DFM2800 Fully Automatic Wafer Mounter |
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Development of the DDS2300 Fully Automatic Die Separator to Precisely Separate DAF |
| November 6, 2007 |
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Development of a New Wafer Thinning Solution,
the "UltraPoligrind" Wheel |
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Development of the DP08 Series Dry Polishing
Wheel for Stress Relief |
| October 31, 2007 |
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开设 2007日本半导体展览会 专用网站 |
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DISCO will give a presentation at International Packaging Strategy Symposium (IPSS) 2007. |
| October 30, 2007 |
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Product release of the DFD6362 Fully Automatic Dicing Saw with improved productivity for 300 mm wafers |
| October 23, 2007 |
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Development of the new DFL7260 laser saw capable of supporting two laser heads |
| October 15, 2007 |
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DISCO has developed a new laser saw DFL7340/7360 using stealth dicing technology in cooperation with Hamamatsu Photonics |
| September 13, 2007 |
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Earthquake in Sumatra, Indonesia |
| September 6, 2007 |
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Will be displayed at SEMICON Europa 2007 has been added. |
| September 3, 2007 |
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Construction of New
Buildings to Improve BCM Readiness |
| August 13, 2007 |
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EAD6750, A New, Automatic Dicing Engine for Package Singulation has been added. |
| August 6, 2007 |
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刊登了产品、技术资料。 |
| August 3, 2007 |
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Will be displayed at SEMICON Taiwan 2007 has been added. |
| August 2, 2007 |
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Our support for the victims of the earthquake in Niigata and Nagano prefectures, Japan (Final Report) |
| July 26, 2007 |
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Our support for the victims of the earthquake in Niigata and Nagano prefectures, Japan |
| July 17, 2007 |
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This announcement is regarding the earthquake in Japan on July 16. (Update) |
| July 16, 2007 |
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This announcement is regarding the earthquake in Japan on July 16. |
| June 7, 2007 |
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Will be displayed at SEMICON West 2007 has been added. |
| May 31, 2007 |
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Will be displayed at SEMI Expo CIS 2007 has been added. |
| May 21, 2007 |
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DISCO is proud to announce the formation of DISCO HI-TEC (MALAYSIA) SDN. BHD. Ipoh Office. |
| May 16, 2007 |
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公司的工作日历更新完毕。 |
| April 26, 2007 |
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Earthquake in Ehime prefecture, Japan on April 26 |
| April 25, 2007 |
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Our support for the victims of the earthquake in Ishikawa prefecture, Japan (Final Report) |
| April 20, 2007 |
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"Discontinued Machines List" page has been updated. |
| April 19, 2007 |
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"Code of Ethics" has been added. |
| April 16, 2007 |
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Earthquake in Mie prefecture, Japan on April 15, 2007 |
| April 13, 2007 |
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"To Achieve a Better Process
Condition" page has been updated. |
| March 28, 2007 |
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DISCO receives Intel's prestigious supplier continuous quality improvement award |
| March 27, 2007 |
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Our support for the victims of the earthquake in Ishikawa prefecture, Japan |
| March 26, 2007 |
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Earthquake in Ishikawa prefecture, Japan on March 25, 2007 |
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Will be displayed at SEMICON Singapore 2007 has been added. |
| March 22, 2007 |
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Honorary Chairman Kenichi Sekiya Appointed Director Emeritus of SEMI |
| March 7, 2007 |
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Earthquake in Sumatra, Indonesia |
| February 5, 2007 |
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刊登全球营业日历 |
| January 31, 2007 |
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SEMICON China 2007出展产品。 |
| January 11, 2007 |
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Will be displayed at SEMICON Korea 2007 has been added. |
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Will be displayed at 8th IC PACKAGING TECHNOLOGY EXPO has been added. |
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