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News |
| December 25, 2009 |
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年底年初的銷售日程安排 |
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2009年度客戶滿意度調查結果更新完畢。 |
| December 18, 2009 |
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Earthquake in Shizuoka prefecture, Japan on December 17, 18, 2009 |
| December 14, 2009 |
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DISCO responds to the new-type influenza (swine influenza) occurrence (update) |
| December 2, 2009 |
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Introducing the DFG8340, a grinder for processing φ8" wafers to an extremely precise degree of flatness |
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Introducing the DAD342 for φ8" Wafers: Compact Dicing Saw with a Width of only 650 mm |
| November 30, 2009 |
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Introducing the DGP8761 High Level Cleaning Specification: Grinder for φ300 mm Wafers to Provide Better Cleanliness After Thinning |
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Introducing the Gettering DP Wheel, a New Solution for Wafer Ultrathin Finishing: Maintaining the Gettering Performance through the Dry Polishing Process |
| November 18, 2009 |
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Introducing the DFL7020, Economical and Small Footprint Fully Automatic Laser Saw to Scribe Sapphire LED |
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Introducing the DFL7161, Fully Automatic Laser Saw for 300 mm Wafers with Enhanced Basic Performance |
| November 16, 2009 |
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Improvement in financial management levels in response to the recent business recovery |
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Introducing the Fully Automatic Thinning Process of Sapphire Substrates for LED |
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“Discontinued Machines List” page has been updated. |
| November 11, 2009 |
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Introducing the Z09 Series, Electroformed Blades with Fine Grit Size and High Strength Bond |
| November 9, 2009 |
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Introducing the DFD6341, fully automatic dicing saw for 200 mm diameter wafers with enhanced productivity |
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DISCO resumes construction of the new building at the Chino Plant |
| November 6, 2009 |
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The top page has been redesigned. |
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The dedicated website regarding SEMICON Japan 2009 has been released. |
| November 4, 2009 |
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DISCO responds to the new-type influenza (swine influenza) occurrence (update) |
| October 23, 2009 |
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Introducing the DFD6760, fully automatic dicing saw for 300 mm diameter wafers with enhanced productivity |
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Introducing the DAD3650, the world's smallest dual-spindle automatic dicing saw |
| October 20, 2009 |
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DISCO responds to the new-type influenza (swine influenza) occurrence (update) |
| October 15, 2009 |
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Notice Concerning Repayment of Loans and Establishment of Commitment for Line of Credit |
| October 9, 2009 |
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Development of the DAS8930 surface planer supporting 300 mm wafers for high-precision cutting and planarization |
| September 18, 2009 |
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DISCO receives the Technology Award of the Japan Society for Precision Engineering 2009 |
| September 17, 2009 |
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Improvement in financial management levels in response to the recent business recovery |
| September 7, 2009 |
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DISCO responds to the new-type influenza (swine influenza) occurrence (update) |
| August 25, 2009 |
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Will be displayed at SEMICON Europa 2009 has been added. |
| August 21, 2009 |
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DISCO responds to the new-type influenza (swine influenza) occurrence (update) |
| August 19, 2009 |
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我們將於SEMICON Taiwan 2009展出。 |
| August 13, 2009 |
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DISCO responds to the new-type influenza (swine influenza) occurrence (update) |
| August 11, 2009 |
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Earthquake in Shizuoka prefecture, Japan on August 11, 2009 |
| August 4, 2009 |
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StayClean-A登載完畢。 |
| July 13, 2009 |
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DISCO selected as one of the finalists for the SEMICON West 2009 Sustainable Technologies Award |
| July 1, 2009 |
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DISCO responds to the new-type influenza (swine influenza) occurrence |
| June 30, 2009 |
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DISCO selected for the FTSE4 Good Global Index in six consecutive years |
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DISCO responds to the new-type influenza (swine influenza) occurrence (update) |
| June 26, 2009 |
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DISCO responds to the new-type influenza (swine influenza) occurrence (update) |
| June 24, 2009 |
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DISCO responds to the new-type influenza (swine influenza) occurrence (update) |
| June 22, 2009 |
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DISCO responds to the new-type influenza (swine influenza) occurrence (update) |
| June 18, 2009 |
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DISCO responds to the new-type influenza (swine influenza) occurrence (update) |
| June 17, 2009 |
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DISCO responds to the new-type influenza (swine influenza) occurrence |
| June 11, 2009 |
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DISCO responds to the new-type influenza (swine influenza) occurrence (update) |
| June 10, 2009 |
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利用雷射進行藍寶石加工登載完畢。 |
| June 8, 2009 |
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DISCO responds to the new-type influenza (swine influenza) occurrence (update) |
| June 3, 2009 |
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DISCO responds to the new-type influenza (swine influenza) occurrence (update) |
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Will be displayed at SEMICON West 2009 has been added. |
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“Building Emergency Procedures” page has been updated. |
| May 20, 2009 |
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DISCO responds to the new-type influenza (swine influenza) occurrence (update) |
| May 15, 2009 |
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Notification of Retirement and Appointment of Personnel |
| May 13, 2009 |
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Development of a Sapphire Substrate Stealth Dicing Process Offering High-Quality, High-Yield Production of High-Intensity LEDs |
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DISCO responds to the new-type influenza (swine influenza) occurrence |
| April 23, 2009 |
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Will be displayed at SEMICON Russia 2009 has been added. |
| April 9, 2009 |
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Will be displayed at SEMICON Singapore 2009 has been added. |
| April 6, 2009 |
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Notice of Corporate Furlough |
| March 19, 2009 |
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DISCO Corporation Announces a New Management Organization |
| March 5, 2009 |
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DISCO receives Intel's prestigious supplier continuous quality improvement award |
| February 26, 2009 |
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Will be displayed at SEMICON China 2009 has been added. |
| February 12, 2009 |
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Notice Regarding Appointments of President, Executive Director, and President of Subsidiary Company |
| January 19, 2009 |
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Notice of relocation: Shanghai office, DISCO Technology (Shanghai) Co., Ltd. |
| January 8, 2009 |
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Will be displayed at 10th IC PACKAGING TECHNOLOGY EXPO has been added. |
| January 6, 2009 |
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Will be displayed at SEMICON Korea 2009 has been added. |
