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IR News
December 26, 2011 New year's breaks at DISCO offices
December 19, 2011 Flooding in Thailand (Update)
December 13, 2011 Change in the Completion Date for the New Kure Plant Building
December 6, 2011 DISCO achieved a five star rating from VLSI research's 2011 customer satisfaction survey
December 5, 2011 DBG Glass Processing
December 2, 2011 Introducing the DAD3360 Automatic Dicing Saw with extended support for 300 mm wafers
November 28, 2011 Introducing the DFG8830, a grinder with a 4-axis and 5-chuck table configuration for hard and brittle materials such as sapphire and SiC
November 25, 2011 Earthquake in Hokkaido prefecture, Japan on November 24, 2011
November 24, 2011 Introducing the energy saving DTU1540 Water Temperature Control Unit
DISCO Has Developed Technology for Separating and Recovering Silicon Sludge from Grinder Wastewater
November 22, 2011 Earthquake in Hiroshima prefecture, Japan on November 21, 2011
November 21, 2011 Earthquake in Ibaraki prefecture, Japan on November 20, 2011
New Addition to the Stealth Dicing Laser Saws for 300 mm Wafers
Introducing the DFL7360FH with Ring Frame Handling Specification
November 17, 2011 Introducing the DFD6560: Ultra-compact Fully Automatic Dicing Saw for 300 mm wafers
November 15, 2011 Announcing the ultra high precision DFS8960 surface planer which supports 300 mm wafers
November 7, 2011 The dedicated website regarding SEMICON Japan 2011 has been released.
November 4, 2011 Process using the 3-point edge alignment
October 27, 2011 Flooding in Thailand [Update]: DISCO Thailand staff to evacuate
October 21, 2011 Flooding in Thailand
October 6, 2011 Earthquake in Kumamoto prefecture, Japan on October 5, 2011
September 30, 2011 High-Quality Grinding of Lithium Tantalate
Earthquake in Fukushima prefecture, Japan on September 29, 2011
September 29, 2011 DISCO Corporation to boost worldwide sales of the CC Filter – a Filtration Unit for Dicing Saw Cutting Water
September 26, 2011 Will be displayed at Productronica 2011 has been added.
September 22, 2011 Earthquake in Ibaraki prefecture, Japan on September 21, 2011
September 8, 2011 Earthquake in Hokkaido prefecture, Japan on September 7, 2011
September 2, 2011 Will be displayed at SEMICON Europa 2011 has been added.
Blade Edge Shape Correction: Flat Dress
September 1, 2011 Manufacturing and shipment of DISCO products (update)
August 19, 2011 Earthquake in Fukushima prefecture, Japan on August 19, 2011
August 12, 2011 Earthquake in Fukushima prefecture, Japan on August 12, 2011
August 5, 2011 我們將於SEMICON Taiwan 2011展出。
August 2, 2011 Earthquake in Shizuoka prefecture, Japan on August 1, 2011
August 1, 2011 Manufacturing and shipment of DISCO products (update)
Earthquake in Fukushima prefecture, Japan on July 31, 2011
July 29, 2011 6-inch GaAs Wafer Thinning when it is Secured with Tape
July 25, 2011 Earthquake in Fukushima prefecture, Japan on July 25, 2011
Earthquake in Miyagi prefecture, Japan on July 23, 2011
July 19, 2011 Earthquake in Ibaraki prefecture, Japan on July 15, 2011
July 6, 2011 Earthquake in Wakayama prefecture, Japan on July 5, 2011
July 1, 2011 Manufacturing and shipment of DISCO products (update)
June 30, 2011 Earthquake in Nagano prefecture, Japan on June 30, 2011
Profiling using a dicing saw 4
June 29, 2011 Will be displayed at Exhibition Micromachine/MEMS 2011 has been added.
June 24, 2011 Notice regarding the expansion of the Operating Officer System with the promotion and new appointment of Operating Officers
June 16, 2011 安全使用說明 - 關於極限轉速更新完畢。
June 15, 2011 Manufacturing and shipment of DISCO products (update)
June 9, 2011 Will be displayed at SEMICON West 2011 has been added.
June 3, 2011 LCD Driver Die Strength and Drop Strength
June 2, 2011 Earthquake in Niigata prefecture, Japan on June 2, 2011
June 1, 2011 2010-11年度客戶滿意度調查結果更新完畢。
Manufacturing and shipment of DISCO products (update)
May 25, 2011 我們將於Photonics festival in TAIWAN 2011展出。
DISCO awarded #1 and #2 customer satisfaction rating among assembly equipment suppliers by VLSI research
May 18, 2011 Start of Radiation Measurements of Precision Processing Equipment
May 17, 2011 Pre-shipment virus scan for Windows-based DISCO equipment
May 13, 2011 Manufacturing and shipment of DISCO products (update)
May 12, 2011 Notice Regarding Prospective Appointments of Executive Directors and Corporate Auditor
April 28, 2011 Manufacturing and shipment of DISCO products (update)
April 26, 2011 DISCO Donations for the Great East Japan Earthquake
Will be displayed at SEMICON Russia 2011 has been added.
April 22, 2011 DISCO selected for the FTSE4 Good Global Index for eight consecutive years
April 21, 2011 Manufacturing and shipment of DISCO products (update)
April 20, 2011 DISCO receives Intel's prestigious supplier continuous quality improvement award
April 15, 2011 Manufacturing and shipment of DISCO products (update)
April 12, 2011 Earthquake in Fukushima Prefecture on April 11 and 12, 2011 (update)
Earthquake in Fukushima Prefecture on April 12, 2011
April 11, 2011 Earthquake in Fukushima Prefecture on April 11, 2011
April 8, 2011 Earthquake in Northern Japan on April 7, 2011
April 7, 2011 Measurement Alignment
April 1, 2011 Manufacturing and shipment of DISCO products (update)
March 29, 2011 Will be displayed at 4th Laser Applications EXPO has been added.
March 28, 2011 Manufacturing and shipment of DISCO products
Will be displayed at SEMICON Singapore 2011 has been added.
Our support for the victims of the Japan earthquake
March 23, 2011 Three newly established DISCO Corporation support branches in China
March 18, 2011 迪思科的產品未受福島核電站形勢的影響
March 17, 2011 關於東北地區太平洋沿岸地震的影響(續報2)
March 15, 2011 關於東北地區太平洋沿岸地震的影響(續報)
March 14, 2011 Business at Head Office R&D Center on March 15, 2011
The Head Office R&D center suspend its operation affected by the earthquake in Northern Japan
Japan Earthquake
March 11, 2011 Earthquake in Miyagi prefecture, Japan on March 11, 2011
March 9, 2011 Earthquake in Miyagi prefecture, Japan on March 9, 2011
March 2, 2011 Warpage due to grinding damage
February 18, 2011 DISCO is Ranked 11th among the Best Workplaces in Japan
February 17, 2011 Will be displayed at SEMICON China 2011 has been added.
January 19, 2011 4CH_CUT
January 14, 2011 DISCO Corporation expands the range of "BS25999-2:2007" BCMS compliance to all precision processing tools


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