| November 24, 2010 |
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DISCO Corporation has developed an edge trimming technology for TSV wafers |
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DISCO's proprietary HogoMax003, a new water-soluble protective film |
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Introducing the DAD3240, Automatic Dicing Saw for φ8" Wafers with the Width of only 650 mm |
| November 22, 2010 |
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Introducing the DWR1721 Deionized Water Recycling Unit with drain water pumping and communication functions with the dicing saw |
| November 16, 2010 |
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Introducing the ZHDG Electroformed Hub Blade Series for High Quality LED Board Cutting |
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Introducing the BH11 Metal Hub Blade Series with Improved Usability |
| October 28, 2010 |
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Interval Dressing |
| October 13, 2010 |
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The Center Offset Grinding of TAIKO Wafer |
| September 14, 2010 |
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Introduction of the Gettering DP wheel |
| September 8, 2010 |
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Development of a New Process to Stabilize LED Color |
| August 31, 2010 |
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"Discontinued
Machines List" has been updated. |
| August 11, 2010 |
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The advantages of non-contact setup (NCS) |
| June 23, 2010 |
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The process of ring removal for TAIKO wafer by circle cutting |
| May 31, 2010 |
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The Applications of a TAIKO Wafer |
| May 14, 2010 |
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A processing method for gallium arsenide |
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Thickness control by using NCG |
| April 22, 2010 |
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Laser Dicing Solutions更新完畢。 |
| March 24, 2010 |
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SiC Dicing using the ZP Blade |
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Merits of Ultrasonic Wave Processing 3 |
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Processing of Glass to a Mirror Surface |
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Grinding Wheels suitable for GaAs Wafers |
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Grinding of Hollow Wafers |
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Ring Grinding |
| February 2, 2010 |
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Introducing the Ultrasonic Dicing Technology, Effective for the Processing of SiC for Power Semiconductors |
