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DISCO HOME > Laser Dicing Solutions > DISCO Laser Equipment > Lineup

Laser Dicing Solutions

Lineup
To realize various applications, there are five models for ablation and two models for stealth dicing.
DISCO proposes the system most suitable for your processing needs.

Ablation
Ablation
DFL7160 DFL7161 DFL7260
DFL7160
 DFL7161
 DFL7260
For φ300 mm wafers For φ300 mm wafers For φ300 mm wafers
With two laser heads
DAL7020 DFL7020
DAL7020
 DFL7020
For φ6" wafers For φ6" wafers

Stealth Dicing
Stealth Dicing
DFL7340 DFL7360
DFL7340
 DFL7360
For φ8" wafers For φ300 mm wafers

Laser Dicing Solutions

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Dicing and Grinding Service
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