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Exhibition Information
The highlights
Sapphire grinding and stealth dicing (SD) for LED
Laser process (Hasen cut)
DBG for ultrathin and small die
TAIKO solution for backside metallized wafers
Tecnisco products for medical industry
Exhibited Samples
LED process solutions
Sapphire ground wafers and SD wafers
Stealth dicing (Hasen cut)
DBG（Dicing Before Grinding）process
TAIKO process
Waterjet technology
Precision cutting samples from Tecnisco
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