DISCO Corporation joins SiLKnet Alliance
To Develop Dicing Technologies for Low-K Materials
SANTA CLARA, CA-(January 1, 2004)- DISCO Corporation today announced it has joined the SiLKnet Alliancesm data network to develop wafer dicing solutions for SiLK semiconductor dielectric resins. DISCO Corporation is the 26th member to join the SiLKnet Alliance, which is the semiconductor industry's first and broadest technical collaboration focused on low-k materials integration in copper interconnect structures.
"As the world's largest and most experienced researcher of dicing technology, DISCO Corporation excels in providing dicing
solutions for Low-k materials," said Kazuma Sekiya, Executive Director and President of Precision Systems for DISCO Corporation. "Our engineers have pioneered technologies that have achieved excellent dicing throughput for low-k materials, and through our relationship with the SiLKnet Alliance we are committed to developing precision dicing solutions for SiLK dielectric resins."
DISCO Corporation joins the SiLKnet Alliance as a member of the Test, Assembly and Packaging module. Member companies in this module develop technologies that complement and support the use of SiLK resins and companion ENSEMBLE interlayer dielectric coatings across the spectrum of current and future back-end-of-line processes, from probing, dicing and bonding to bumping, probing, flip-chip and wafer-level packaging techniques.
"DISCO Corporation brings an important intelligence resource to the table, as dicing low-k materials has proven to be challenging," said Greg Bauer, development director for the SiLKnet Alliance. "With its expertise in dicing, grinding and thinning solutions, DISCO Corporation will aid the smooth integration of low-k materials by developing processes to meet the specific demands of SiLK resins."
About DISCO Corporation
DISCO is a leading service and technology company supplying grinding, dicing, and polishing solutions
to a variety of industries. A staff of highly skilled engineers, world-class application labs, and leading edge manufacturing
facilities support a global customer base. DISCO solutions are used in manufacturing the products that touch nearly every
person in the world every day.
About the SiLKnet Alliance Data Network
The SiLKnet Alliance leverages the specialized expertise and technology resources of a diverse group of industry suppliers to enable the development of proven, production-ready materials, equipment and processes that support the integration of SiLK resin and porous SiLK resin, as well as ENSEMBLE interlayer dielectric coatings, in every key back-end-of-line (BEOL) manufacturing step - including the clean; CMP; etch; spin-on track; metrology; ashing; and test, assembly and packaging process modules.
Sponsored by The Dow Chemical Company (NYSE: DOW), the SiLKnet Alliance has been widely cited as an example of how multiple companies can collaborate toward a common, customer-driven goal. The membership of the SiLKnet Alliance has grown to include 26 semiconductor industry suppliers since its formation in 2001. For more information about the SiLKnet Alliance.
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Contact:
DISCO Corporation
Corporate Strategy Division
Management Strategy Department
Marketing Communications Team
Phone: 81-3-4590-1090Fax: 81-3-4590-1094 |
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