EAD6750, A New, Automatic Dicing Engine for Package Singulation
DISCO Corporation (Head Office: Ota-ku, Tokyo, Japan, President: Hitoshi Mizorogi) has completed development of the EAD6750, a Automatic Dicing Engine with 2 chuck tables. The primary advantage of this new machine is that it improves productivity for the package singulation process based on DISCO's extensive experience in that field.
Development of the EAD6750
Package singulation refers to the process in which BGA, CSP, or QFN substrates are separated into individual packages using an integrated system which includes a dicing saw and a handling unit. While DISCO commands a dominant share of the market for the dicing saw portion, there are a number of suppliers making the handler portion, which typically includes cleaning, pickup, place, and inspection functions. DISCO has been supplying dedicated singulation saw engines, the EAD Series, to handler manufacturers since 1998. The EAD Series has been widely accepted as the industry standard platform for the saw portion of singulation equipment since saw based singulation became the process of choice.
Due to the increasing pressure to lower packaging costs, there is a desire to improve the productivity of the package singulation system. This is why DISCO has developed the EAD6750.
Features of the EAD6750
Increased Throughput Using Two Chuck Tables
Each of the two chuck tables is outfitted with an independent alignment microscope, enabling cutting to take place on one chuck while simultaneously transferring, aligning, and cleaning on the other chuck table. Substantial improvement in throughput can be achieved as a result.
Photograph: EAD6750
Schedule
September, 2007Begin accepting orders
Contact: Aya Osumi
Marketing Communications Team,
Marketing Communications Department,
Corporate Strategy Division
DISCO Corporation
E-Mail:
Phone: 81-3-4590-1090
