Development of the DDS2300 Fully Automatic Die Separator to Precisely Separate DAF
DISCO Corporation has newly developed the DDS2300 to precisely separate DAF (Die Attach Film)(*), which is necessary for thin die stacking. Also, it can expand the application range of the DBG (Dicing Before Grinding) process. This product will be on display at SEMICON Japan 2007 in December.
* Die Attach Film is special adhesive film to mount or stack die instead of epoxy adhesive (refer to illustration)
Development Background
Recently, the bonding material called DAF is becoming essential for stacking die in SiP (System in Package) devices, which are being used in mobile equipment. Typically, DAF is attached to the wafer backside and then singulated by cutting it in the next process with a dicing saw at the same time as the wafer. During the cutting process, issues such as DAF burring occur (refer to photograph 1 below). Furthermore, if DAF is used in the DBG process, it would be necessary to attach DAF to the wafer after die separation and then singulate just the DAF (refer to the process illustration). If a laser is used to cut this DAF, lower costs are also needed because consumable materials would be necessary to prevent debris adhesion.
In addition, even with the stealth dicing process, which was announced on October 15, 2007, technology to realize high-grade die separation after laser irradiation is needed.
DISCO has developed the DDS2300 fully automatic die separator to response to these needs and support φ300 mm wafers.
Photograph 1: DAF burring
Photograph 2: DAF cutting using DDS2300
DBG + DAF process flow
DDS2300 Features
[High-grade separation of DAF]
A cool expansion system is used to separate DAF by lowering its temperature to make it brittle so that it will fracture.
Since this eliminates the "anchor effect(*)", which is an issue with full cut dicing using existing blades, it is possible to suppress DAF burring and improve pickup capability. Also, it reduces consumable-material costs in the DAF laser cut after DBG.
* anchor effect is a phenomenon where the DAF bites into the dicing tape like an anchor caused by the load from dicing. If this phenomenon severely occurs, an increase load would be required to pickup the die and that may lead to die breakage or defective pickup. (Refer to the illustration below)
[Able to use existing dicing ring frames]
Normally, after dicing tape is expanded, it becomes difficult to handle ring frames in the next process because of the tape sag, and it becomes necessary to transfer the workpiece to a special jig. With the DDS2300, it is possible to take up the sagging tape using the heat shrink properties in the dicing tape, and then transfer the ring frame to a die bonder, which is the next process.
[SD process]
For a wafer that has been mounted on to a dicing frame and then processed with stealth dicing, the DDS2300 supports high-grade die and DAF separation using its tape expansion function.
DDS2300
Schedule
December 2007
On display at SEMICON Japan 2007
May 2008
DDS2300 sales start date
Contact: Aya Osumi
Marketing Communications Team,
Marketing Communications Department,
Corporate Strategy Division
DISCO Corporation
E-Mail:
Phone: 81-3-4590-1090
