Development of the ZHCR Series Reduces Tip Shape Collapse of Thick Blades
DISCO Corporation has developed new dicing blade "ZHCR Series" to respond to diverse
processing needs, following progress in miniaturization and high functionalization of electronic devices.
This products will be on displayed at SEMICON Japan 2007 in December.
Development Background
While the demand for ultra-thin blades has been increasing in recent years, applications that require thick blades in excess of 60 µm, to remove TEG from the street surface, also exist.
Dicing with this type of thick blade may have particular problems that result from the collapse of the blade tip shape. The ZHCR series is a new hub blade that was developed to resolve this shape collapse.
Illustration of blade tip shape change
<Existing series thick blade>
With a thick blade, it becomes difficult for the cutting debris powder to be extracted from underneath the blade.
The cutting debris powder, which remains under the blade, starts to gradually scrape away the center of the blade.
If processing continues, the blade center will be excessively scrapped away, and an irregular shape will form.
The narrowed leg is unable to bear the processing load. This causes abnormalities such as cracking and chipping.
<ZHCR series>
The ZHCR series reduces the wear of just the blade tip center using a special blade structure.
This realizes stable processing because it maintains the initial blade tip shape.
Problems when blade tip shape collapses
The main problems that occur when he blade tip shape collapses are;
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Wider kerf
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Blade bending and damage during the Z2 step cut
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Increased chipping
Wider kerf
Bending and damage during Z2 step cut
Increased chipping
Product Characteristics
The ZHCR series realizes a special blade structure using DISCO unique technology to reduce tip shape collapse for blades exceeding 60 µm thickness, and to provide stable processing.
It proves its worth in the following processes where blade tip shape collapse easily occurs.
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Processes that use blades with thicknesses exceeding 60 µm
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Processing of wafers with a lot of TEG on the street*1
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Blade dicing after laser grooving*2
*1
Blade tip shape collapse occurs easily because wear occurs only on the section of the blade in contact with the TEG.
*2
In the laser grooving process (refer to the illustration below) pattern remains in the center of the street. As a result, partial wear (or center wear) occurs easily in the Z1 blade during a step-cut dicing process.
Laser grooving process
Schedule
December 2007
On display at SEMICON Japan 2007
January 2008
Sample orders start
Contact: Aya Osumi
Marketing Communications Team,
Marketing Communications Department,
Corporate Strategy Division
DISCO Corporation
E-Mail:
Phone: 81-3-4590-1090
