DISCO receives the Technology Award of the Japan Society for Precision Engineering 2009
DISCO Corporation (Headquarters: Ota-ku, Tokyo; President: Kazuma Sekiya) announced that it has been awarded the Technology Award of the Japan Society for Precision Engineering 2009 for its technology developments.
Award-winning technology
Development of a dicing saw with ultrasonic wave technology and its application in processing of electronic devices. |
Award winners
Four engineers at R&D division |
The reason for the award
DISCO was recognized for the development through a variety of experiments and analyses of a high quality, low cost processing technology for electronic devices which are difficult to process by conventional methods, as well as elemental technologies such as ultrasonic wave spindles, optimized blade shape, non-contact power supply and automatic vibration amplitude measurement.
Merits of dicing with ultrasonic wave technology
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Improved feed speed is possible for the processing of materials such as glass and ceramics, which until now have been difficult to cut with a blade, by significantly lowering the processing current
 Lowering production cost. |
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Processing is possible of quartz glass and alumina ceramics, which until now have been difficult to cut, by using an electroformed blade.
Improving processing quality including reduction in chipping and lowering production cost |
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Preventing blade glazing and loading
Stabilizing processing quality |
About this award
This award is given to researchers and engineers who achieve innovative progress in the area of precision engineering, such as the development of precision equipment and research and development regarding production engineering. The organizer is the Japan Society for Precision Engineering.
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