Introducing the DAD3650, the world's smallest dual-spindle automatic dicing saw
DISCO Corporation (Head Office: Ota-ku, Tokyo; President: Kazuma Sekiya) has newly developed the DAD3650. As the world's smallest*1 dual-spindle automatic dicing saw, it realizes almost double the throughput when dicing small die devices, such as SAW (surface acoustic wave) filters and discrete semiconductors, while having two thirds the footprint, compared to the existing DAD3350*2 model.
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*1
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As of October 13, 2009 for dual-spindle automatic dicing saws
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*2
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Single-spindle automatic dicing saw with a record of over 1,000 machines sold
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Development Background
In the case of a small die device, such as a SAW filter or discrete semiconductor, it takes time to process one workpiece and replacing workpieces is not frequent, so an automatic dicing saw, which does not require substantial initial costs, is normally used.
However, due to the recent trend of requesting lower prices for semiconductor and electronics parts, needs for further improving productivity have intensified even for automatic dicing saws which process such devices.
In order to satisfy these needs, DISCO has developed a dicer, which provides higher throughput using the dual-spindle mechanism with the world's smallest footprint, for the market currently using only single-spindle automatic dicing saws. |
DAD3650 Features
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Thanks to the dual-spindle system, the DAD3650 can perform dual cutting, which dices with two spindles simultaneously. This makes it possible to offer a maximum of almost twice*3 the throughput compared with the single-spindle dicer. The throughput proves more effective for small die devices, where processing one workpiece takes time.
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*3
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The throughput varies depending on the workpiece size and processing parameters. |
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Dual Spindles
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<World's smallest footprint> |
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As a result of optimizing the design of the dual-spindle automatic dicing saw, the footprint of the DAD3650 is the world's smallest*1 – two-thirds that of the DAD3350.
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*1 As of October 13, 2009 for dual-spindle automatic dicing saws
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| <Highly flexible for diverse processing needs> |
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In spite of the small footprint, the DAD3650 can handle workpiece sizes up to 200 mm in diameter or 250 mm square, the same as the DAD3350. This new model can enhance processing quality and process various workpieces through the step cut which dices in two stages by installing different blades on each spindle.
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Footprint Comparison
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Schedule
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December 2009
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The DAD3650 will be exhibited at SEMICON Japan 2009.
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August 2010
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Scheduled for sales launch |
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