Introducing the DFL7161, Fully Automatic Laser Saw for φ300 mm Wafers with Enhanced Basic Performance
DISCO Corporation (Head Office: Ota-ku, Tokyo; President: Kazuma Sekiya) has developed the DFL7161, a successor model of the existing fully automatic laser saw DFL7160. This new laser saw has greatly improved basic performance, such as productivity and reliability.
Development Background
 Lately, in accordance with lower dielectric constant and more brittleness of a Low-k film due to device pattern miniaturization, the application of the laser grooving process of Low-k film wafers has been expanding. Along the trend of smaller and thinner final products, laser full cut, which realizes high-speed and high-quality processing of thin wafers, has also attracted more attention.
In order to meet these needs, DISCO is introducing the DFL7161 with enhanced performance in productivity and reliability. This fully automatic laser saw aims at doubling the wafer processing ability compared with the DFL7160. |
Features of the DFL7161
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<Basic specifications>
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- φ300 mm wafer processing
- Low-k grooving and laser full cut of silicon wafers and compound semiconductors
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<Enhanced productivity>
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- Separating conventionally combined protective film coating section and wafer cleaning section enables conducting film coating and cleaning simultaneously
- Shorter wafer transport time thanks to faster movement of the transfer axis
- Shorter axis acceleration and deceleration time thanks to higher performance of the processing axis
- Increased X-axis maximum feed speed from 600 mm/s to 1000 mm/s
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<Better usability>
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- Improved log analysis function of the machine and oscillator enables data analysis to further increase productivity
- Installation of the graphical operation software enables efficient and intuitive operation, such as designating the wafer examination position
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<Improved extendibility>
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- Adopting highly extendable optical and control systems
- Due to expanded space to install the oscillator, various laser heads and optical systems, suitable for individual applications, are usable
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Schedule
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Unveiling at SEMICON Japan
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December 2009
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Scheduled to start production
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April 2010
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