Introducing the DFL7020, Economical and Small Footprint Fully Automatic Laser Saw to Scribe Sapphire LED
DISCO Corporation (Head Office: Ota-ku, Tokyo; President: Kazuma Sekiya) has developed the DFL7020. This fully automatic laser saw for 6-inch diameter wafers and frames to scribe sapphire LED has a simple structure that adds the transport function to the DAL7020, our existing automatic laser saw, while realizing low price and small footprint.
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Development Background
 Recently, the demand for LED to use in cell phones, TV and PC backlights has grown. Such demand will even become higher in accordance with the dissemination of LED lighting for general consumers. In response to this trend, the requests for reducing costs in the market of LED related machines will be further strengthened.
DISCO has already launched three laser saws to process sapphire, a substrate material for an LED: the DFL7160 fully automatic laser saw and the DAL7020 automatic laser saw to scribe using ablation as well as the DFL7340 for stealth dicing.
Now, DISCO is introducing the DFL7020, a low price and small footprint fully automatic laser saw to scribe using ablation. This increases the choices for a machine to process sapphire LED. |
Features of the DFL7020
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<Basic specifications>
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- Fully automatic laser saw to scribe sapphire
- Usable up to 6-inch diameter wafers and dicing frames
- Able to build in backside alignment, a shape recognition function, height sensor, and cleaning unit as options
- Chinese language (traditional or simplified) screens are available
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<Low price>
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- Thanks to a simple structure that adds the transport unit to the DAL7020 automatic laser saw, a low price is realized.
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<Small footprint>
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- Compared with the conventional DFL7160 fully automatic laser saw for scribing sapphire, the footprint is reduced by about 10%.
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Schedule
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Unveiling at SEMICON Japan
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December 2009
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Scheduled to start production
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July 2010
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