Introducing the DAD342 for φ8" Wafers:
Compact Dicing Saw with a Width of only 650 mm
DISCO Corporation (Head Office: Ota-ku, Tokyo; President: Kazuma Sekiya) has developed the DAD342 for φ8" wafers. This automatic dicing saw will be exhibited at SEMICON Japan 2009 (from December 2 to 4, at Makuhari Messe).
Development Background
As the automatic dicing saw for φ8" wafers, DISCO has already put the DAD3350 on the market. In response to the increased demands for an easier to use and compactor automatic dicing saw and a cost reduction in the dicing process, DISCO has developed the DAD342. |
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Features of the DAD342
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<Basic specification>
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- A blade dicer for φ8-inch wafers and 8-inch square workpieces*
* An optional dedicated jig is necessary.
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<Compact size>
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- The width is only 650 mm.
- Its footprint is two thirds that of the DAD3350.
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<Improved usability>
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- The auto alignment function, well accepted in the higher models, is installed.
- Intuitive operation is realized thanks to the 12.1-inch LCD touch panel with GUI (graphical user interface).
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<High processing adaptability>
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- Use of the high-powered 1.8 kW spindle enables processing of hard-to-process materials, such as silicon and ceramics.
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<Reduced maintenance frequency>
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- Installed microscope lens shutter and scope blow function reduces the maintenance frequency, which can improve the operating efficiency of the machine.
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<Eco-conscious design>
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- The DAD342 does not use the 15 hazardous chemical substances listed in "List of DISCO Restricted Substances" including the six substances specified in the EU RoHS Directive.
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Schedule
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Unveiling at SEMICON Japan 2009
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December 2009
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Scheduled to start production
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:
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September 2010
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