Introducing the DFG8830, a grinder with a 4-axis and 5-chuck table configuration for hard and brittle materials such as sapphire and SiC |
| DISCO Corporation (Head Office, Ohta-ku, Tokyo, President: Kazuma Sekiya) has developed the DFG8830. This fully automatic grinder, which has four axes and five chuck tables, will be exhibited at SEMICON Japan 2011 (12/7 - 9, Makuhari Messe) |
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Background of Development
In accordance with the increase in variety of products in which LED are installed, demand for sapphire wafers for LED substrates and SiC (silicon carbide) for power semiconductors* is increasing; and their diameters are getting bigger. Accordingly the need is increasing for automatic grinding and processing of individual wafers with these hard and brittle materials which are very difficult to process. For such circumstances, DISCO has developed the fully automatic DFG8830 grinder, which by using the four-axis applications can cope with the varied grinding needs of hard and brittle materials.
* Power semiconductors:
Semiconductor elements used in power exchangers, such as inverters and converters, and whose usage is drastically increasing in electrical vehicles, such as hybrid cars, as well as air conditioning systems.
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Features of the DFG8830
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4-axis structure
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- Various wheel and grinding parameters are assigned to the four axes (spindles), so this equipment can even more flexibly satisfy numerous processing needs, such as focusing on productivity and high quality finishing having less damage
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For wafers with up to 8-inch support substrates
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- This equipment can grind a workpiece bonded to a support substrate made of glass or ceramics with an applicable substrate size of 5 to 8 inches.
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Small footprint
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Use of the bridge type structure at the spindle axis and optimization of the transport section layout makes it possible to realize the small 3.5 m2 footprint for the installation area even though there are four axes and five chuck tables.
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Future Schedule
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| SEMICON Japan 2011 exhibit: Dec 2011 |
| Start of high-volume production: June 2012 |
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