Introducing the DAD3360 Automatic Dicing Saw with extended support for 300 mm wafers |
| DISCO Corporation (Headquarters: Ota-ku, Tokyo, President: Kazuma Sekiya) has developed the DAD3360. This semi-automatic dicing saw for 300 mm wafers will be on display at SEMICON Japan 2011 (from Dec. 7 to 9 at Makuhari Messe). |
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Development background
There is a growing demand for dicing solutions for ceramic substrates for high-brightness LED and other difficult-to-cut materials in addition to support for larger workpiece sizes, such as 300 mm silicon wafers and multiple workpiece mounting of package substrates.
The DAD3360 Automatic Dicing Saw was developed to meet these requirements, maintaining the diverse processing solutions and optional accessories available in its predecessor, while also adding support for 300 mm workpieces as standard.
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Features
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Support for larger workpieces while maintaining the same footprint as existing models |
- 300 wafers-compatible as standard (optional support available for 250 mm square workpieces).
- Same width as its predecessor, the DAD3350.
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Wide-ranging optional accessories for various applications
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- Enhanced cutting power for processing of difficult-to-process materials such as glass and ceramics.
- Maximum blade size: 5inches
- 2.2 kW high-torque spindle available
- Higher throughput using the alignment function for multiple workpiece mounting (Maximum workpieces: 16).
- Alignment possible for workpieces that change shape or expand/shrink during processing.
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Future plans
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| SEMICON Japan 2011 exhibit: Dec 2011 |
| Start of high-volume production: October 2012 |
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