DISCO Corporation (Head office: Ota-ku, Tokyo; President: Kazuma Sekiya) has developed the DCS1441, a new addition to our lineup for automatic cleaning system with ø8-inch wafer support. The DCS1441 offers improved cleaning performance and enhanced usability to meet the ever growing demand for high wafer cleanliness from our customers.
This unit will be on display at SEMICON Japan 2014 (Dec. 3 to 5 at the Tokyo Big Sight).
|As the market expands due to demand for smartphones and tablets, the demand for image sensors and other electronic parts, which require high wafer cleanliness, is also expanding accordingly. Alternatively, there also many cases where manufacturers add cleaning processes after the dicing step to reduce the occurrence of die defects caused by the adhesion of contaminants to wafers. The new DCS1441 is an automatic cleaning unit which meets these needs with its high cleaning performance.