SiteMap
About DISCO
Investors
CSR
DISCO HOME
>
Product Information
> Accessory Equipment
Product Information
Accessory Equipment
DISCO's accessory units help maintain and improve the precision and accuracy of DISCO's dicers, grinders, and polishers.
Ultrasonic-wave Dicing Unit
Details
Ultrasonic-wave Dicing Unit
A unit employing a special blade which allows ultrasonic-wave assisted processing
Deionized Water Recycling Unit
Details
DWR1721
Deionized water recycling unit combines the capabilities of producing deionized water, controlling the water temperature, filtering, and waste water treatment in a single unit.
Water Temperature Control Unit
Details
DTU152
For Silicon wafer cutting / Wheel coolant flushing method
DTU1531
DTU162
For Electronic components cutting / Wheel coolant circulating method
Resistivity Management Unit
Details
CO
2
Injector
Prevent particle adhesion and device damage caused by static electricity.
Automatic Cleaning System
Details
DCS1440
For silicon wafer, glass board or ceramic workpiece cleaning
DCS1460
DCS141
*
(*) Discontinued Machines
Precision Machines
Dicing and Cutting Saws
Laser Saws
Grinders
Polishers and Dry Etchers
Die Separator
Surface Planer
WaterJet Saw
Products for New Processes
Precision Processing Tools
Dicing Blades
Grinding Wheels
Dry Polishing Wheels
For Your Safety
Other Products
Accessory Equipment
Ultrasonic-wave Dicing Unit
Deionized Water Recycling Unit
Water Temperature Control Units
Resistivity Management Unit
Automatic Cleaning System
Related Products
Downloads
Catalog Downloads
SECS/GEM Communication Specification Downloads
Personal Information Protection Policy
User Agreement
Contact
Back To Top