A combination of an ultra-thin diamond blade and an aluminum hub provides enhanced operation efficiency and stable cutting results.
In combination with DISCO's vast application knowledge, these blades provide excellent cutting results when dicing silicon wafers and compound semiconductor wafers such as GaAs.
Advanced dicing process - bevel and step cutting
Wide range of grit sizes and bond types to support various application requirements
Easy to handling ultra-thin blades
Shorter blade change time - increased productivity
Environment-friendly PP (Polypropylene) packaging
For the detailed specification and functions, view our catalogues.