The DP08 series enables polishing of ultra-thin wafers with DISCO's unique dry polishing process. In addition to having a low environmental impact by not using chemicals, it achieves high die strength and is simple to operate compared to a process that uses slurry.
Features
Low environmental impact due to the process requiring no slurry
High die strength thanks to the original dry polishing process
Catalog Download
For the detailed specification and functions, view our catalogues.
