In accordance with ultrathinning of wafers, a decline in gettering performance becomes a major concern. Gettering DP is a new solution which realizes high die strength and good gettering performance at the same time using DISCO's unique dry polishing process. This chemical-free process has less environmental impact and polishes thin wafers by operations easier than the process using slurry.
Features
Realizes gettering performance equal to the normal grinding
Low environmental impact due to the process requiring no slurry
High die strength thanks to the original dry polishing process
Catalog Download
For the detailed specification and functions, view our catalogues.
