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DISCO HOME > Product Information > Grinders > Automatic Grinder 800 Series

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Automatic Grinder 800 Series
800 Series grinders are single-spindle, single-chuck-table units; users perform workpiece loading and unloading manually. These versatile machines grind not only silicon and other semiconductor substrates but also high-load, hard-to-process ceramics, glasses and sapphire (small diameter). In-feed grinding is standard, and creep feed is optional.

In-feed grinding Creep feed grinding
Fully Automatic 8000 Series Fully Automatic 800 Series Automatic 800 Series
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Workpiece Size Max ø 200 mm (ø 8")
ø 4" to ø 8" when the universal chuck table used
Grinding Method Anomalous In-feed grinding with wafer rotation
Spindle Type Air bearing with high frequency motor
Number of axes 1
Output (kW) 4.2
Revolution speed (min-1[rpm]) 1,000 - 7,000
Z-axis vertical stroke (mm) 120 (with zero point)
Z-axis vertical grinding feed speed (mm/s) 0.0001 - 0.05
Z-axis vertical fast feed speed (mm/s) 50
Min. Z-axis vertical movement (µm) 0.1
Min. Z-axis vertical movement resolution(µm) 0.1
Chuck Table Chuck table type Porous chuck table
Chuck method Vacuum
Number of revolutions (min-1[rpm]) 0 - 300
Number of chuck tables 1
Spark Out (chuck table revolutions setting) 0 - 999
Y-axis back and forth movement stroke (mm) 430
Y-axis back and forth grinding feed speed (mm/s) 0.001 - 50
Y-axis back and forth rapid feed speed (mm/s) 200
Y-axis back and forth movement min. command unit (mm) 0.01
Y-axis back and forth movement min. resolution (mm) 0.01
Grinding Wheel Diamond wheel ø 200
Grinding Accuracy Thickness variation within one wafer(µm) Less than 1.5
(when the dedicated chuck table is used)
Finish surface roughness(µm) Ry 0.13 (with #2000 finish)
Ry 0.15 (with #1400 finish)
Machine dimensions
(W x D x H) (mm)		 600 x 1,700 x 1,780
Machine weight (kg) Approx. 1,300
*

The above specifications may change due to technical modifications. Please confirm when placing your order.
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