DISCO's grinding wheels grind silicon, compound semiconductors, crystals, and a wide variety
of other materials. They are an essential part of DISCO's excellent Kezuru (Grinding) solutions.
Rotation Speed Limit
Material Safety Data Sheet (MSDS)
|
Series |
Application |
Feature |
 |
GF01
Series |
Silicon and compound semiconductor wafers, crystals and ceramics for electronic components, and many other substrates and materials, etc. |
New wheel series featuring advanced coolant water delivery |
 |
GF01
Series
BR385 |
Borosilicate glass, non-alkali glass, crystal,various glass types, etc. |
Porous vitrified bond, fixed abrasive wheels resulting in high quality grinding of SiC wafers. |
|
GF01
Series
BT100/BT300 |
Silicon and compound semiconductor wafers, crystals and ceramics for electronic components, and many other substrates and materials, etc. |
By employing the newly developed resin bond, it realizes lower edge chipping and grinding damage, and is the optimum 1-axis bond for thin grinding. |
 |
GS08
Series |
SiC, Al2O3, Si3N4, etc. |
Porous vitrified bond, fixed abrasive wheels resulting in high quality grinding of SiC wafers. |
 |
IF
Series |
Silicon and compound semiconductor wafers, crystals and ceramics for electronic components, and many other substrates and materials, etc. |
Standard grinding wheels with extensive record of success |
 |
Poligrind |
Silicon wafers, etc. |
ultra-high-quality grinding |
 |
Ultra
Poligrind |
Silicon wafers, etc. |
Silicon and compound semiconductor wafers, crystals and ceramics for electronic components, and many other substrates and materials, etc. |
 |
RS
Series※ |
Silicon and compound semiconductor wafers, crystals and ceramics for electronic components, and many other substrates and materials, etc. |
This new finish grinding wheel achieves high die strength while maintaining gettering performance. |
|
|
| * The DFG-83H/6 is no longer sold, however the supply of the RS Series continues. |
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