Countermeasure for Preventing Particle Adhesion in Die LED Processing
Application processing examples
One of the concerns when dicing die LED is the deterioration of brightness caused by adhesion of
particles on the silicon resin section.
StayClean-A is very effective
for preventing such particle adhesion.
Practical Example
Die LEDs have the following configurations.
-
Dome type
Aims at diffusing light
Usage: Lighting, etc.
-
Flat type
Focuses on light extraction efficiency and stability
Usage: Backlight
Use of StayClean-A in the die LED dicing enables preventing particle adhesion on the silicon resin section, thereby reducing the deterioration of the brightness.
| Coolant used | Before processing | After processing |
|---|---|---|
| D.I. water |  |
 |
| D.I. water ＋ StayClean-A（0.1%） |
 |
 |
Silicon resin surface photographs (DISCO internal test results)
Contact
Please feel free to contact us with any questions or inquiries.
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Applications Support
A free-of-charge test cut is performed at an application lab to confirm whether achieving the customer's needs is possible.
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Dicing and Grinding Service
It is effective in sample and prototype manufacturing during development or low-volume production. Designated engineers will provide support based on the desired leadtime and at reasonable cost.
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