Japanese Chinese Traditional Chinese Simplified Korean English
About DISCO Investors CSR
HomeNews ReleasesSolutionsProduct InformationCustomer SupportCustomer SatisfactionContact
DISCO HOME > About DISCO > DISCO Corporate History


2004-2011 Creating customer value and rising social responsibility

TOP 1996-2003 2012-
Company History Product History
OHSAS 18001 certification received for Hiroshima Works.
SCQI Award received from Intel Corporation for 4th year in a row.
Kenichi Sekiya was appointed as Vice Chairman of Tokyo Chamber of Commerce and Industry.
Head office and R&D center was relocated to 13-11 Omori-kita 2-chome, Ota-ku, Tokyo.
New DISCO company logo was introduced.
6"-compatible automatic dicing saw DAD3220/3230/3430 and 8"-compatible fully automatic dicing saw DFD6450 developed.
New dicing blade series ZH05 and Z05, new grinding wheel Poligrind and a new grinding wheel bond BT100 for the GF01 Series developed.
Consolidation with the maintenance and service subsidiary DISCO ENGINEERING SERVICE, LTD.,
SCQI (Supplier Continuous Quality Improvement) Award for 2004 received from Intel Corporation.
Developed dicing application using ultrasonic wave.
Developed the "DFE8040" and "DFE8060" plasma etching machines.
Developed a backgrinding processing method called "TAIKO".
Received the 2005 SCQI (Supplier Continuous Quality Improvement) Award from Intel Corporation.
Kenichi Sekiya retired from the position of representative director and Chairman. And He was appointed as Honorary Chairman.
Expanded ISO14001 certification to all factories in Japan.
Shinano Denki became a subsidiary and changed name to Daiichi Components.
Developed a curvilinear processing technology called "Edge Profile Grinding".
Developed the "ZP07 Series," "VT07 Series," and "R07 Series BB100 bond" dicing blades, and "GF01 Series BR385 bond" grinding wheels.
Laser processing technology to improve production of high-intensity LED developed.
Kenichi Sekiya appointed as Director Emeritus of SEMI.
Received the 2006 SCQI (Supplier Continuous Quality Improvement) Award from Intel Corporation.
Developed the "DFL7340/7360" laser saws based on a business alliance with Hamamatsu Photonics.
Developed the "DFD6362" dicing saw for 300 mm wafer processing.
Developed the "DP08 Series" dry polishing wheel.
Developed the "DGP8761" grinder/polisher for 300 mm wafer processing and the "DFM2800" multi-wafer mounter.
Developed the "ZHCR Series" and "ZHZZ Series" hub blades.
Completed construction of new building for head office and R&D center.
Obtained certification for Business Continuity Management System Standard (BS25999-2: 2007).
Received the SCQI (Supplier Continuous Quality Improvement) Award for the 2007 business year from Intel Corporation.
Used Kaspersky products for the first embedded security solutions in semiconductor manufacturing equipment.
Developed the "DWR1720" deionized water recycling unit, which produces zero wastewater, for use with dicing saws.
Developed the "DAL7020" compact laser saw, which is only 600 mm wide.
Developed the "EAD6750" dicing engine, in which 2 chuck tables are installed.
Developed the "DDS2300" fully automatic die separator.
Developed the 10 µm thick "ZHZZ" hub blade, which is the thinnest hub blade in the industry.
Received the SCQI (Supplier Continuous Quality Improvement) Award for the 2008 business year from Intel Corporation.
Hitoshi Mizorogi was appointed as Chairman and CEO, and Kazuma Sekiya was appointed as President and COO.
Selected for the FTSE4Good Global Index in seven consecutive years.
Introducing the DAD3650, the world's smallest dual-spindle automatic dicing saw.
Introducing the DFD6760, fully automatic dicing saw for 300 mm diameter wafers with enhanced productivity.
Introducing the Fully Automatic Thinning Process of Sapphire Substrates for LED.
Introducing the DFL7161, Fully Automatic Laser Saw for 300 mm Wafers with Enhanced Basic Performance.
Completion of a new building at the Kuwabata plant.
Received Intel's prestigious Supplier Continuous Quality Improvement award.
Selected for the FTSE4Good Global Index in seven consecutive years.
Completion of a new building at the Chino plant.
Established a service office in Vietnam.
Listed in the Dow Jones Sustainability Indexes Asia Pacific.
Developed the ZHDG electroformed hub blade series for high quality LED board cutting and the BH11 metal hub blade series with improved usability.
Developed the DWR1721 Deionized Water Recycling Unit with drain water pumping and communication functions with the dicing saw.
Developed the DAD3240, Automatic Dicing Saw for 8" Wafers with the Width of only 650 mm.
Received the 2010 SCQI (Supplier Continuous Quality Improvement) Award from Intel Corporation.
Listed in the Dow Jones Sustainability Indexes Asia Pacific for the Second Consecutive Year.
Selected for the FTSE4Good Global Index in eight consecutive years.
Developed the ultra high precision DFS8960 surface planer which supports 300 mm wafers.
Developed the Stealth Dicing Laser Saws for 300 mm Wafers DFL7360FH with Ring Frame Handling Specification.
Developed Technology for Separating and Recovering Silicon Sludge from Grinder Wastewater.
Developed the energy saving DTU1540 Water Temperature Control Unit.
Developed the DFG8830, a grinder with a 4-axis and 5-chuck table configuration for hard and brittle materials such as sapphire and SiC.
Developed the DAD3360 Automatic Dicing Saw with extended support for 300 mm wafers.

In November 2004, DISCO relocated from Higashi-Kojiya(Tokyo, Ota-ku), which had been its base for nearly twenty years, to the new head office and R&D center in Omori-Kita(Tokyo, Ota-ku).

When the head office moved to Higashi-Kojiya from Shinagawa in 1984, the number of employees working there was about two hundred. After the move, the number of employees increased with the growth of DISCO, and twenty years later in 2004 the number of employees working at the head office was approaching one thousand. As a result of repeated measures to increase the facilities for employees, such as rebuilding aged buildings and constructing new buildings, the head office facilities in 2004 were dispersed over seven locations, with six buildings in Higashi-Kojiya and the training center in Higashi-Shinagawa several kilometers away. Since sometimes the trial manufacture site, application lab or one's desk was located in different buildings, on rainy days engineers where often seen walking quickly between two buildings carrying a tool box in one hand and an umbrella in the other.

After the head office moved to Omori-Kita in 2004, all of DISCO's core facilities, such as administration, R&D, application lab and service departments, were in the same building. This enabled DISCO to provide better service and solutions to the customer. In addition, based on the thinking that "the employees create value therefore to create true customer value an agreeable working environment is necessary," a fitness gym and massage area was established in the head office.

Along with the new head office and R&D Center, DISCO is employing earthquake-absorbing structures in a new factory, which will support the anticipated increase in abrasive tool demand, and a new building within the grounds of the head office and R&D Center, which will support diverse applications. DISCO considers that continuing to provide a stable product supply and advanced solutions is a social responsibility in every situation. This is how DISCO continues to evolve.

TOP 1996-2003 2012-


Personal Information Protection Policy
User Agreement
Use of the DISCO Corporate Name
Guarantee policy for customer using DISCO Products
Back To Top