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Corporate Social Responsibility (CSR)

Environmental Considerations in Products

Green Product Guidelines
Green Product Guidelines were laid out in March 2004 to guide design and development that reduces environmental impact throughout a product's lifecycle. The guidelines put emphasis on energy conservation, the concept of reduction, reuse and recycling, and ease of product disposal following use.

Environmental Considerations in Precision Processing Tooling
Conducting Lifecycle Assessments
We have been conducting lifecycle assessments (LCA)* for our equipment, but in fiscal 2004 we drew up an LCA Manual to provide a set of standards for making evaluations. Lifecycle assessments are an effective tool for quantitatively ascertaining carbon dioxide emissions, which contribute to global warming, and for DISCOvering ways to reduce energy consumption in equipment and lessen environmental impact.

LCA Comparison of DAD522 and DAD3230
The product structure and characteristics of new product DAD3230 and old product DAD522 are similar, and an LCA comparison was conducted on both machines. The results showed that DAD3230 decreased total CO2 emissions by 8.6% compared to DAD522. Also, for processing one chip, DAD3230 produces 25.6% less CO2 emissions than DAD522. The substantial decline in CO2 emissions is due to accelerating work processing through design and development oriented to energy conservation. Our objectives when developing new products are underpinned by such LCA comparisons.

Comparison of CO2 Output Per Chip (5 mm x 5 mm)

* LCA stands for lifecycle assessment. It is a method for assessing the impact of a product on the environment throughout its entire lifecycle, from procurement of raw materials to manufacturing, transport, use and disposal.

Environmental Considerations in Precision Processing Equipment
Presently, market need is mounting for thinner internal devices as cell phones and other devices become increasingly thin, compact and highly functional. In order to strengthen chips, which tend to break more readily as they become thinner, it is necessary to reduce damage from grinding (fracture layer) that occurs inside the wafer. This process is called stress relief and the general methods for accomplishing this are chemical mechanical polishing (CMP), which uses chemical agents like slurry and etching.
DISCO has sold products that use dry polishing technology instead of chemical agents, but thanks to the development of Poligrind it has become possible to omit the stress relief process altogether. Poligrind conducts processing with only cold water and without the use of any chemical agents while reducing the fracture layer to the full extent possible. This revolutionary grinding wheel fulfills the market's technical requirements while saving energy and reducing environmental impact.

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