DISCO
Japanese Chinese Traditional Chinese Simplified Korean English
SiteMap
About DISCO Investors CSR
HomeNews ReleasesSolutionsProduct InformationCustomer SupportCustomer SatisfactionContact
DISCO HOME > News Releases > Event Schedule

News Releases


Event Schedule


Date Event / Seminar Venue The highlights
2020 SEMICON Korea 2019 Korea • Machine: DFD6341
• Laser dicing (Stealth dicing, ablation)
• SiC processing
• Power Device Processing
• Processes for electronic components
• Processes for high bump wafers
• Ultrasonic-wave Dicing Unit
• Precision processing tools
NEPCON JAPAN Japan • Machine: DAD3651
• Processes for electronic components
• Laser dicing (Stealth dicing, ablation)
• Packaging solutions
• Power Device Processing
• Precision processing tools
News Releases

Personal Information Protection Policy
User Agreement
Use of the DISCO Corporate Name
Guarantee policy for customer using DISCO Products
Back To Top