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News Releases

Event Schedule

Date Event / Seminar Venue The highlights
2020 SEMICON Taiwan 2020 Taiwan • Machines: DFL7362, DFD6363, DAD3661, DTU1550
• Wafer Thinning
• Power Device Processing
• Laser dicing (Stealth dicing, ablation)
• Plasma dicing
• DHT KKM Service
VIRTUAL SEMICON West 2020 U.S.A • SEMICON West Goes Virtual
• Machines: DFD6363, DWR1722, MUSUBI, DFG8640, DIS100
• Laser Processing(LEAF 2.0 and other)
• Plasma dicing
SEMICON China 2020 China • Machine: DFD6561, DAD3660(1.8kW), DIS100, DWR1720, DFL7161, DGP8761+DFM2800
• Wafer Thinning
• Laser Processing
• Power Device Processing
• Electronic Component Processing
SEMICON Korea 2020 Korea • With the World Health Organization’s (WHO) declaration of the Novel Coronavirus (2019 nCoV) as a global health emergency, SEMICON Korea 2020, originally scheduled February 5-7, has been canceled.
NEPCON Japan Japan • Machine: DAD3651
• Processes for electronic components
• Laser dicing (Stealth dicing, ablation)
• Packaging solutions
• Power Device Processing
• Precision processing tools
News Releases

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