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News Releases


Event Schedule


Date Event / Seminar Venue The highlights
2019 SEMICON Japan 2019 Japan
SEMICON Europa 2019 Germany • Machines: DFD6363, DWR1722, DAD3360, DAD3221, Manual wafer mounter
• New Fully Automatic Dicing Saw DFD6363 demonstration with DWR1722
• Ultra-thinning solutions (DBG, TAIKO)
• High bump wafer grinding and dicing
• KABRA and SiC wafer processing
• Laser processing for MEMS and various materials
• AOI (Automatic Optical Inspection) service
SEMICON Taiwan 2019 Taiwan • Machine: DFD6363, DFL7362, DDS2300, Metrology Unit
• Wafer thinning processes
• Laser dicing
• SiC processing
• Planarization
• Plasma dicing
SEMICON West 2019 U.S.A. • Machine: Minimal Fab Grinder, Minimal Fab 3D Microscope
• KABRA process
• Laser dicing (Stealth dicing, ablation)
• Wafer thinning processes
• KKM Services
Laser World of PHOTONICS Germany • Laser dicing (Stealth dicing, ablation)
• Low-k grooving
• Laser-lift-off (LLO)
• KABRA process
• Via hole drilling
PSECE Philippines • SiC processing
• Ultrasonic technology
• Dicing blade
• Grinding wheel
SEMICON Southeast Asia 2019 Malaysia • Machine: DFD6363, DAS8930
• Wafer thinning processes
• Planarization
• Plasma dicing
• Processes for high bump wafers
SEMICON China 2019 China • Machine: DAD3241, DFD6561, FL7161
• Laser dicing (Stealth dicing, ablation)
• Wafer thinning processes
• Plnarization
• Solutions for power device
• Plasma dicing
SEMICON Korea 2019 Korea • Machine: DAD3241
• Laser dicing (Stealth dicing, ablation)
• SiC processing
• Processes for electronic components
• Processes for high bump wafers
• Panel level packaging
48th NEPCON JAPAN Japan • Machine: DFG8640, DAD3350
• Precision processing tools
• Laser dicing (Stealth dicing, ablation)
• Panel level packaging
• SiC processing
• Processes for electronic components
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