Japanese Chinese Traditional Chinese Simplified Korean English
About DISCO Investors CSR
HomeNews ReleasesSolutionsProduct InformationCustomer SupportCustomer SatisfactionContact
DISCO HOME > News Releases > Event Schedule > SEMICON Japan 2017
  • English
  • English
SEMICON Japan 2017 出展のご案内

Dates: December 13 (Wed) - 15 (Fri), 2017 10 a.m. to 5 p.m.
Venue: Tokyo Big Site, Japan  Booth: East hall 1 No.1336


This event is now over.
Thank you very much for taking the time to visit the DISCO booth.

Precision Processing Equipment

With exhibitions using over thirty actual machines, it will be one of the largest ever exhibitions at SEMICON Japan. The equipment features will be introduced through demonstrations.

Dicing Saw

Laser Saw


Surface Planer

Accessory Equipment

Precision Processing Tools

These are precision processing tools which embody DISCO’s advanced Kiru, Kezuru, Migaku technologies. As well as a wide range of actual exhibitions, accessories which improve usability of the tool will also be introduced.

Dicing Blade

Grinding Wheel

Polishing Pads

Applications and Processing Samples

These are the application technologies which lead to finding the best combination of equipment and tools. A variety of real-life examples will be introduced, along with a wide range of processing samples.

Wafer Thinning
  • DBG/SDBG process
  • Plasma etching
Laser Processes
  • Stealth dicing
  • Ablation
  • Laser lift off
Processes for Electrical Components
  • Dicing processes for thick materials including PZT and glass
  • High planarization grinding and DBG processing performed on LT
Plasma Dicing
  • Plasma dicing wafers
SiC Processing
  • Solutions for making SiC wafers
  • SiC substrate dicing and thinning
KABRA Process
  • Laser SiC ingot slicing
Large-Size Workpiece Processing
  • Grinding and planarization processes which support fan-out WLP
Planarization Process
  • Planarization of the backgrinding tape surface
  • Bump planarization
  • Planarization of the re-wiring layer
Processes for High Bump Wafers
  • Grinding process solutions for high bump wafers
DI Water Recycling
  • Introduction of recycling DI water for dicing saws
Processing Consultation
  • Consultations for dicing and grinding processes

* Please note that the exhibits may change without notice.

Comments and Inquiries
SEMICON Japan 2017
Personal Information Protection Policy
User Agreement
Use of the DISCO Corporate Name
Guarantee policy for customer using DISCO Products
Back To Top