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Press Release

December 6, 2016

DISCO Develops Panel Level Packaging Compatible Dicing Saw, DFD6310:
To Be Displayed with UNITRAY Transfer Unit at SEMICON Japan

DISCO Corporation (headquarters: Ota-ku, Tokyo, President: Kazuma Sekiya) has newly developed DFD6310, a panel-level packaging compatible dicing saw that supports workpieces up to 720 x 610 mm. The equipment will be displayed at SEMICON Japan 2016 (December 14-16, Tokyo Big Site), equipped with the DISCO-developed UNITRAY transfer-unit specification, which transfers singulated packages to a UNITRAY.

Development Background
As a technology that can realize significant progress in miniaturization, thinning, and higher integration compared to conventional packages, the need for FOWLP (fan-out wafer level packaging) is rising. Within this production process, there are an increasing number of cases where panel-level packaging is adopted, aimed at lowering costs. DFD6310, the panel-level packaging compatible dicing saw, was developed based on such production needs for FOWLP, which is gaining more use in mobile devices.
Features
  • Supported workpiece size: up to 720 x 610 mm and 670 x 670
  • Cut stroke: 720 mm
  • Equipped with facing dual-spindles
  • Equipment size: 1,960 (W) x 2,280 (D) x 1,840 mm (H)
    (UNITRAY transfer unit specification: 3,560 (W) x 2,280 (D) x 1,930 (H) mm)
UNITRAY Transfer-Unit (Developed by DISCO)

The packages singulated by the dicing saw are stored in a JEDEC tray to be sent to the next process. The equipment used for storing the packages in the JEDEC tray (transfer unit) is usually attached to the side of the dicing saw, but depending on the package size, a UPH gap between the dicing saw and transfer unit may occur. By attaching DISCO’s independently developed UNITRAY transfer-unit to the dicing saw, the singulated packages can be temporarily transferred to the UNITRAY and then stored into the JEDEC tray using a standalone JEDEC tray transfer-unit for more effective production without a UPH gap between the equipment and the transfer unit. As a result, the UPH balance of the dicing saw and standalone JEDEC tray can be maintained and multiple production lines can be arranged flexibly.

Note: Click to zoom

UNITRAY (Developed by DISCO)
  • Low-adhesion sheet attached to prevent package displacement
  • Same size as JEDEC tray
[Exhibition]

JEDEC Tray Transfer Unit

The DFD6310 UNITRAY transfer-unit specification and a demo of the standalone JEDEC tray transfer unit will be connected via a conveyor belt, based on the actual production concept, and put on display at SEMICON Japan.

Schedule
December 2016 To be exhibited at SEMICON Japan 2016
April 2017 Start of test cuts
Summer 2017 Start of sales
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