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Ultrasonic-wave Dicing Unit

Ultrasonic-wave Catalog
The ultrasonic-wave dicing unit employs a special blade which allows ultrasonic-wave assisted processing. The unit may also be retrofitted to an existing device (limited compatibility).
Ultrasonic-wave oscillation reduces the processing load, allowing highly-efficient processing.
This achieves high-quality, high-speed processing of difficult to cut materials such as SiC, glass and alumina ceramics.

Ultrasonic-wave dicing unit blade U09 Series

Ultrasonic-wave dicing unit blade lineup with all bond types.
Allows ultrasonic-wave assisted processing of any material.
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