Product Information

Dicing Blades

DISCO's dicing blades are used with dicing and cutting saws to groove, cut, and dice silicon, compound semiconductors, glass, ceramics, crystals, and almost any other material. They are one key to DISCO's excellence in Kiru (dicing) processing.

For Your Safety

Rotation Speed Limit

Safety Data Sheet (SDS)

Series	Application	Bond type	Blade type
ZH05 Series	Silicon and compound semiconductor (GaAs, GaP, etc.) wafers, oxide wafers (LiTaO₃, etc.), etc.	Electroformed bond	Hub (integrates an aluminum flange and the NBC-Z series)
ZH14 Series	Silicon and compound semiconductor (GaAs, GaP, etc.) wafers, oxide wafers (LiTaO₃, etc.), etc.
ZHCR Series	Silicon wafer, etc.
ZHDG Series	Chip LED board, Various types of semiconductor packages, etc.
ZHFX Series	Oxide wafers (LiTaO₃), etc.
ZHRF Series	Silicon wafer, etc.
ZHZZ Series	Silicon wafers and compound semiconductor (GaAs, GaP, etc.) wafers, etc.
NBC-ZH Series	Silicon and compound semiconductor (GaAs, GaP, etc.) wafers, oxide wafers (LiTaO₃), etc.
B1A Series	Electronic parts, optical devices, various types of semiconductor packages, ceramics, mono-crystal ferrite, glass, etc.	Metal bond	Hubless (Washer)
TM11 Series	Raw ceramic, various types of packaging substrate	Metal bond
NBC-Z Series	Silicon, GaAs, GaP, various types of semiconductor packages, etc.	Electroformed bond
P1A Series	Glass, crystal, quartz, LiTaO₃, various types of semiconductor packages, ceramics, etc.	Resin bond
R07 Series	Glass, quartz, ceramics, etc.	Resin bond
VT07/12 Series	Si₃N₄, SiC, Crystal, Sapphire, etc.	Vitrified bond
Z05 Series	Various types of semiconductor packages, Green ceramics, Hard and brittle material, etc.	Electroformed bond
Z09 Series	PZT, LiTaO₃, Ceramics, Silicon wafers, etc.
ZP07 Series	Composite materials (Silicon + glass wafer etc), ceramics, etc.
A1A/K1A Series	Ceramics, Various types of glass, Ferrite, Quartz, Crystal, Metals, etc.	A1A: Metal bond	Steel core
A1A/K1A Series		K1A: Resin bond	Steel core