
DISCO's dicing blades are used with dicing and cutting saws to groove, cut, and dice silicon,
compound semiconductors, glass, ceramics, crystals, and almost any other material. They are one key to DISCO's excellence
in Kiru (dicing) processing.
Rotation Speed Limit
Safety Data Sheet (SDS)
|
Series |
Application |
Bond type |
Blade type |
 |
ZH05 Series |
Silicon and compound semiconductor (GaAs, GaP, etc.) wafers, oxide wafers (LiTaO3, etc.), etc. |
Electroformed bond |
Hub (integrates an aluminum flange and the NBC-Z series) |
 |
ZH14
Series |
Silicon and compound semiconductor (GaAs, GaP, etc.) wafers, oxide wafers (LiTaO3, etc.), etc. |
 |
ZHCR
Series |
Silicon wafer, etc. |
 |
ZHDG
Series |
Chip LED board, Various types of semiconductor packages, etc. |
 |
ZHFX
Series |
Oxide wafers (LiTaO3), etc. |
 |
ZHRF
Series |
Silicon wafer, etc. |
 |
ZHZZ
Series |
Silicon wafers and compound semiconductor (GaAs, GaP, etc.) wafers, etc. |
 |
NBC-ZH
Series |
Silicon and compound semiconductor (GaAs, GaP, etc.) wafers, oxide wafers (LiTaO3), etc. |
 |
B1A
Series |
Electronic parts, optical devices, various types of semiconductor packages, ceramics, mono-crystal ferrite, glass, etc. |
Metal bond |
Hubless (Washer) |
 |
TM11 Series |
Raw ceramic, various types of packaging substrate |
 |
NBC-Z
Series |
Silicon, GaAs, GaP, various types of semiconductor packages, etc. |
Electroformed bond |
 |
P1A Series |
Glass, crystal, quartz, LiTaO3, various types of semiconductor packages, ceramics, etc. |
Resin bond |
 |
R07 Series |
Glass, quartz, ceramics, etc. |
 |
VT07/12 Series |
Si3N4, SiC, Crystal, Sapphire, etc. |
Vitrified bond |
 |
Z05 Series |
Various types of semiconductor packages, Green ceramics, Hard and brittle material, etc. |
Electroformed bond |
 |
Z09 Series |
PZT, LiTaO3, Ceramics, Silicon wafers, etc. |
 |
ZP07
Series |
Composite materials (Silicon + glass wafer etc), ceramics, etc. |
 |
A1A/K1A Series |
Ceramics, Various types of glass, Ferrite, Quartz, Crystal, Metals, etc. |
A1A: Metal bond |
Steel core |
K1A: Resin bond |
|
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