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GS08 Series

GS08 Series
GS08 series grinding wheels employ a new porous vitrified bond with excellent swarf removal capability as well, the new bond feeds in the wheel coolant water in order to grind extremely hard SiC wafers. Grinding with a fixed abrasive produces a surface roughness approaching a polish. Grinding can be performed on tape mounted wafers making it unnecessary to use wafer carriers. The total process is much easier compared to a slurry processes.

  • Grinding with a fixed abrasive results in a surface roughness approaching a polish
  • Grinding can be performed on tape-mounted wafers for easy operation
  • Non-slurry process for a low environmental impact
Catalog Download
For the detailed specification and functions, view our catalogues.
GS08 Series Catalog (PDF:591KB)
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