Demand is growing for ultra-thin LCD driver die packages, which are used to power and control LCD screens on mobile phones and computers, to realize compact highly functional devices. These advances have led to a growing demand for high-strength die.

Dicing Before Grinding Process (DBG)

The following graph outlines test results for die strength and drop strength for die processed using conventional grinding method and DBG.
Die processed using the DBG process showed less backside chipping compared to conventional grinding processes, displaying superior die strength and drop strength.

• Photo 1:Conventional grinding processing results

  

• Photo 2:DBG processing results

  

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