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DISCO HOME > News Releases > Event Schedule

News Releases


Event Schedule


Date Event / Seminar Venue The highlights
2015 December 16 - 18 SEMICON Japan 2015 Japan
November 11 - 13 IC China 2015 China
November 10 - 13 Productronica Germany
October 7 - 9 18th Mechanical Components & Materials Technology Expo Osaka M-Tech Japan
October 6 - 8 SEMICON Europa 2015 Germany
September 2 - 4 SEMICON Taiwan 2015 Taiwan
July 14 - 16 SEMICON West 2015 U.S.A.
Machine: DAD3220, DAG810
Laser technology(stealth dicing, ablation)
SDBG(Stealth dicing before grinding)
Blade dicing
DBG(Dicing before grinding)
Grinding of various materials
TAIKO process
Planarization process
June 24 - 26 6th Medical Device Development Expo MEDIX Japan
Laser dicing
Blade dicing
Thinning technology
June 22 - 25 Laser World of Photonics Germany
Machine: DFL7341, Frame-to-frame mounter/expander
Laser technology(stealth dicing, ablation, lift off)
SDBG(Stealth dicing before grinding)
June 17 - 18 SEMICON Russia 2015 Russia
TAIKO Process
Laser technology(Hasen, Sapphire stealth dicing)
Surface planarization
Ultrasonic dicing
April 22 - 24 SEMICON Southeast Asia 2015 Malaysia
Machine: DFD6362 with Automatic Blade Changer
Dicing technologies
Solutions for power device
TAIKO Process
Planarization process
March 25 - 28 LED Taiwan 2015 Taiwan
Laser lift off solutions
Sapphire grinding
Laser technology
Planarization process
Solutions for LED
March 17 - 19 SEMICON China 2015 China
Machines: DAG810, DFL7161, DFD6560
TAIKO Process
Package grinding
Planarization process
Dicing technologies
Solutions for power device
Solutions for TSV
February 4 - 6 SEMICON Korea 2015 Korea
Machine: DWR1721
Wafer thinning technology
Solutions for hard to process materials
Solutions for power device
February 4 - 6 5th Medical Device Development Expo MEDIX Japan
Blade dicing
Laser technology
Wafer thinning technology
January 14 - 16 16th IC PACKAGING TECHNOLOGY EXPO Japan
Machines: DAD3360
Wafer thinning technology
Solutions for hard to process materials
Solutions for power device
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