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DISCO HOME > News Releases > Event Schedule

News Releases


Event Schedule


Date Event / Seminar Venue The highlights
2016 December 14 - 16 SEMICON Japan 2016 Japan
November 11 - 13 IC China 2016 China
October 25 - 27 SEMICON Europa 2016 France
October 5 - 7 19th Mechanical Components & Materials Technology Expo Osaka M-Tech Japan
September 7 - 9 SEMICON Taiwan 2016 Taiwan
July 12 - 14 SEMICON West 2016 U.S.A.
June 8 - 9 SEMICON Russia 2016 Russia
Wafer thinning technology (DBG & SDBG process)
TAIKO process
Laser dicing (Stealth dicing, ablation)
Sapphire processing
Consultation of dicing grinding service
April 26 - 28 SEMICON Southeast Asia 2016 Malaysia
Machine: DFD6560, DWR1721, StayClean Injector
Neo DicerNet
Laser dicing (Stealth dicing, ablation)
Dicing technology for difficult to cut materials
Wafer thinning technology (DBG & SDBG process)
TAIKO process
March 15 - 17 SEMICON China 2016 China
Machine: DFD6560, DAD3350, DFL7161, DWR1721, DAG810
Wafer thinning technology (DBG & SDBG process)
Laser dicing (Ablation)
TAIKO process
SiC processing
Panel level packaging
Planarization process
NEO DicerNet
Automatic Blade Changer
January 27 - 29 SEMICON Korea 2016 Korea
Machine: DFD6560
Wafer thinning technology (DBG & SDBG process)
Laser dicing (Ablation, Stealth dicing)
TAIKO process
SiC processing
Sapphire processing
Panel level package
Planarization process
Processes for electrical components
January 27 - 29 InterAqua 2016
7th International Water Solution Exhibition
Japan
Machine: DWR1722
A super-compact deionized water recycling system for use with dicing saws
January 13 - 15 17th IC PACKAGING TECHNOLOGY EXPO Japan
Machines: DAD3360
Laser dicing (Ablation, Stealth dicing)
Panel level packaging
Sapphire processing
SiC processing
Processes for electronic components
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