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DISCO HOME > News Releases > Event Schedule

News Releases


Event Schedule


Date Event / Seminar Venue The highlights
2014 December 3 - 5 SEMICON Japan 2014 Japan
October 7 - 9 SEMICON Europe 2014 France
September
24 - 26
Mechanical Components & Materials Technology Expo Osaka Japan
September 3 - 5 SEMICON Taiwan 2014 Taiwan
July 8 - 10 SEMICON West 2014 U.S.A.
SDBG/DBG process
TAIKO application
Package process
Solutions for Power Device
LED process solutions
Laser Technology
Planarization
June 24 - 26 LASYS Germany
Machines: DFL7161
Processing for various LED materials
Processing of non-silicon materials
Solutions for Power Device
June 17 - 19 Photonics Festival in Taiwan 2014 Taiwan
Processing for various LED materials
Solutions for Power Device
May 14 - 15 SEMICON Russia 2014 Russia
Dicing before Grinding Process
Thin Grinding through TAIKO application
Laser Technologies
Sapphire and SiC material processing
Wafer processing services provided in our own facility
April 23 - 25 SEMICON Singapore 2014 Singapore
Wafer thinning technology
Solutions for Power Device
Package process
Processing of non-silicon materials
Automatic blade changer
Secondhand equipment business
April 16 - 18 7th Laser & Applications Expo Japan
Laser Technologies (Ablation process and stealth dicing)
March 18 - 20 SEMICON China 2014 China
Machines: DFL7161, DFD6560, DAD3650, DAS8930
Planarization
Laser Technologies
Package process
February 12 - 14 SEMICON Korea 2014 Korea
Machines:DFD6362ABC(Auto Blade Changer)
SDBG Process
Solutions for Power Device
TSV
January 15 - 17 15th IC PACKAGING TECHNOLOGY EXPO Japan
Machines: Minimal grinder
LED process solutions
Package process
Solutions for Power Device
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