DISCO
Japanese Chinese Traditional Chinese Simplified Korean English
SiteMap
About DISCO Investors CSR
HomeNews ReleasesSolutionsProduct InformationCustomer SupportCustomer SatisfactionContact
DISCO HOME > News Releases > Event Schedule

News Releases


Event Schedule


Date Event / Seminar Venue The highlights
2019 SEMICON Japan 2019 Japan
SEMICON Europa 2019 Germany
productronica India India
SEMICON Taiwan 2019 Taiwan
SEMICON West 2019 U.S.A.
SEMICON Southeast Asia 2019 Malaysia
SEMICON China 2019 China
SEMICON Korea 2019 Korea • Machine: DAD3241
• Laser dicing (Stealth dicing, ablation)
• SiC processing
• Processes for electronic components
• Processes for high bump wafers
• Panel level packaging
48th NEPCON JAPAN Japan • Machine: DFG8640, DAD3350
• Precision processing tools
• Laser dicing (Stealth dicing, ablation)
• Panel level packaging
• SiC processing
• Processes for electronic components
News Releases

Personal Information Protection Policy
User Agreement
Use of the DISCO Corporate Name
Guarantee policy for customer using DISCO Products
Back To Top