DISCO
Japanese Chinese Traditional Chinese Simplified Korean English
SiteMap
About DISCO Investors CSR
HomeNews ReleasesSolutionsProduct InformationCustomer SupportCustomer SatisfactionContact
DISCO HOME > News Releases > Event Schedule

News Releases


Event Schedule


Date Event / Seminar Venue The highlights
2015 December 16 - 18 SEMICON Japan 2015 Japan
November 13 - 15 IC China 2015 China
November 10 - 13 Productronica Germany
October 6 - 8 SEMICON Europa 2015 Germany
September 2 - 4 SEMICON Taiwan 2015 Taiwan
July 14 - 16 SEMICON West 2015 U.S.A.
June 22 - 25 Laser World of Photonics Germany
June 17 - 18 SEMICON Russia 2015 Russia
April 22 - 24 SEMICON Southeast Asia 2015 Malaysia
March 25 - 28 LED Taiwan 2015 Taiwan
March 18 - 20 SEMICON China 2015 China
February 4 - 6 SEMICON Korea 2015 Korea
Machine: DWR1721
Wafer thinning technology
Solutions for hard to process materials
Solutions for power device
February 4 - 6 5th Medical Device Development Expo MEDIX Japan
Blade dicing
Laser technology
Wafer thinning technology
January 14 - 16 16th IC PACKAGING TECHNOLOGY EXPO Japan
Machines: DAD3360
Wafer thinning technology
Solutions for hard to process materials
Solutions for power device
News Releases

Personal Information Protection Policy
User Agreement
Use of the DISCO Corporate Name
Contact
Back To Top