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DISCO HOME > News Releases > Event Schedule

News Releases


Event Schedule


Date Event / Seminar Venue The highlights
2017 December 13 - 15 SEMICON Japan 2017 Japan
November 14 - 17 SEMICON Europa and Productronica Germany • Thin wafer solutions
• Narrow street wafer processing
• Laser dicing and grooving
• Plasma dicing
• DISCO presentation at FLEX Europe Conference on November 15 - 16
October 25 - 27 IC China 2017 China • DFD6361ABC, DWR1721
October 4 - 6 20th Mechanical Components & Materials Technology Expo Osaka M-Tech Japan
September 13 - 15 SEMICON Taiwan 2017 Taiwan • DAS8930, DFD6361, DCS1460, DAD3650
• Laser dicing (Stealth dicing, ablation)
• Plasma dicing
• SiC processing
• Planarization
July 11 - 13 SEMICON West 2017 U.S.A. • DAG810, DWR1722
• Laser dicing (Stealth dicing, ablation)
• Plasma dicing
• DBG/SDBG
• SiC processing
June 26 - 29 Laser World of Photonics Germany • Laser dicing (Stealth dicing, ablation)
• KABRA wafer
• Thin wafer solutions
• DISCO presentation at Photonics Forum in Hall A3 on June 27
April 25 - 27 SEMICON Southeast Asia 2017 Malaysia • DFD6341, DWR1710 and more
• Laser dicing (Stealth dicing, ablation)
• Plasma dicing
• Ultrasonic dicing
• DBG/SDBG
4/19-21 FINE CHEMICALS JAPAN Japan • Applications and examples of semiconductor microfabrication technology
March 14 - 16 SEMICON China 2017 China • Machine: DFL7161, DFD6362ABC, DAD323 and more
• Laser dicing (Stealth dicing, ablation)
• Plasma dicing
• SiC processing
• Planarization
February 8 - 10 SEMICON Korea 2017 Korea • Machine: DFD6560
• Laser dicing (Stealth dicing, ablation)
• SiC processing
• Processes for electronic components
January 18 - 20 18th IC PACKAGING TECHNOLOGY EXPO Japan • Machine: DAD3360
• Laser dicing (Stealth dicing, ablation)
• Panel level packaging
• Sapphire processing
• SiC processing
• Processes for electronic components
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