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DISCO HOME > News Releases > Event Schedule

News Releases


Event Schedule


Date Event / Seminar Venue The highlights
2018 SEMICON Japan 2018 Japan
SEMICON Europa and Electronica Germany
IC China 2018 China
21st Mechanical Components & Materials Technology Expo Osaka M-Tech Japan
SEMICON Taiwan 2018 Taiwan
SEMICON West 2018 U.S.A.
SEMICON Southeast Asia 2018 Malaysia • Machine: DFD6362,DTU1550
• Processes for thin wafers (DBG/ SDBG)
• Processes for high bump wafers
SEMICON China 2018 China • Machine: DAD3221,DFL7161,DAG810
• Laser dicing (Stealth dicing, ablation)
• Panel level packaging
• Processes for electronic components
• Planarization
SEMICON Korea 2018 Korea • Machine: DFD6561
• Laser dicing (Stealth dicing, ablation)
• SiC processing
• Processes for electronic components
• Processes for high bump wafers
• Panel level packaging
47th NEPCON JAPAN Japan • Machine: DAD3650
• Laser dicing (Stealth dicing, ablation)
• Panel level packaging
• SiC processing
• Processes for electronic components
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