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DISCO HOME > News Releases > Event Schedule

News Releases


Event Schedule


Date Event / Seminar Venue The highlights
2019 SEMICON Korea 2019 Korea • Machine: DAD3241
• Laser dicing (Stealth dicing, ablation)
• SiC processing
• Processes for electronic components
• Processes for high bump wafers
• Panel level packaging
48th NEPCON JAPAN Japan • Machine: DFG8640, DAD3350
• Precision processing tools
• Laser dicing (Stealth dicing, ablation)
• Panel level packaging
• SiC processing
• Processes for electronic components
2018 SEMICON Japan 2018 Japan • Click here for more information
SEMICON Europa 2018 Germany • Machine: DAD3360, DAD3221, DAG810, Manual wafer mounter
• Ultra-thinning solutions (DBG, TAIKO)
• High bump wafer grinding and dicing
• SiC wafer processing
• Laser processing for MEMS and various materials
• AOI (Automatic Optical Inspection) service
productronica India India • Machine: DWR1710
SEMICON Taiwan 2018 Taiwan • Machine: DFD6362 with Automatic Blade Changer, DFD6361, DAD3650, DCS1460
• Laser dicing (Stealth dicing, ablation)
• SiC processing
• Processes for electronic components
• Narrow Street Solution
• Panel level packaging
SEMICON West 2018 U.S.A. • Machine: DAG810 for SiC thinning, DAD3350
• SiC processing
SEMICON Southeast Asia 2018 Malaysia • Machine: DFD6362,DTU1550
• Processes for thin wafers (DBG/ SDBG)
• Processes for high bump wafers
SEMICON China 2018 China • Machine: DAD3221,DFL7161,DAG810
• Laser dicing (Stealth dicing, ablation)
• Panel level packaging
• Processes for electronic components
• Planarization
SEMICON Korea 2018 Korea • Machine: DFD6561
• Laser dicing (Stealth dicing, ablation)
• SiC processing
• Processes for electronic components
• Processes for high bump wafers
• Panel level packaging
47th NEPCON JAPAN Japan • Machine: DAD3650
• Laser dicing (Stealth dicing, ablation)
• Panel level packaging
• SiC processing
• Processes for electronic components
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