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DISCO HOME > News Releases > Event Schedule

News Releases


Event Schedule


Date Event / Seminar Venue The highlights
2017 December 13 - 15 SEMICON Japan 2017 Japan
IC China 2017 China
November 14 - 17 SEMICON Europa 2017 France
October 4 - 6 20th Mechanical Components & Materials Technology Expo Osaka M-Tech Japan
September 13 - 15 SEMICON Taiwan 2017 Taiwan
July 11 - 13 SEMICON West 2017 U.S.A.
June 7 - 8 SEMICON Russia 2017 Russia
April 25 - 27 SEMICON Southeast Asia 2017 Malaysia
March 14 - 16 SEMICON China 2017 China
Machine: DFL7161, DFD6362ABC, DAD323 and more
Laser dicing (Stealth dicing, ablation)
Plasma dicing
SiC processing
Planarization
February 8 - 10 SEMICON Korea 2017 Korea
Machine: DFD6560
Laser dicing (Stealth dicing, ablation)
SiC processing
Processes for electronic components
January 18 - 20 18th IC PACKAGING TECHNOLOGY EXPO Japan
Machine: DAD3360
Laser dicing (Stealth dicing, ablation)
Panel level packaging
Sapphire processing
SiC processing
Processes for electronic components
News Releases

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