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DISCO HOME > Solutions > Kiru, Kezuru, Migaku Topics

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Kiru, Kezuru, Migaku Topics

The topics page highlights the latest Kiru, Kezuru and Migaku technologies.
Introducing DISCO's accumulated advanced application technologies in response to customers' needs.
Blade Dicing Laser Dicing Grinding Stress Relief DBG / SDBG Others
Introducing processing methods other than existing processes. DISCO continues to focus on the cutting edge of Kiru, Kezuru and Migaku technologies.
An ultra-compact (DWR series) deionized water recycling unit for use with dicing saws
Florescent resin color stabilization using the Surface Planer
Cutting and Planarization Using a Surface Planer
Cutting using a water jet saw
Dicing application with ultrasonic technology
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