This event is now over.
Thank you very much for taking the time to visit the DISCO booth.
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| The highlights |
 Laser technology for LED process |
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Laser technology (ablation and Stealth Dicing) targeted for LED processing of sapphire substrates or heatsink materials and substrates with metal backsides will be introduced. |
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| Contact |
Your comments and questions are welcome.
Please click here to contact us.
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