DISCO
Japanese Chinese Traditional Chinese Simplified Korean English
SiteMap
About DISCO Investors CSR
HomeNews ReleasesSolutionsProduct InformationCustomer SupportCustomer SatisfactionContact
DISCO HOME > News Releases > Event Schedule

This event is now over.
Thank you very much for taking the time to visit the DISCO booth.
The highlights
Laser Technology
DISCO will exhibit a wide range of developed laser applications (stealth dicing, grooving, full cut, etc) with actual processed samples.
Exhibition Information
Precision Machines

Fully Automatic Laser Saw
DFL7340

Fully Automatic Dicing Saw
DFD6362

RCII-2000
Precision Processing Tools
Dicing Blades
Hub blade for high quality substrate dicing
 ZHDG series
Metal hub blade series
 BH11 series
Other blades
Grinding and Polishing Wheels
To improve die strength
 UltraPoligrind
Maintains gettering performance in the dry polishing process
 Gettering DP
Other wheels
Samples on Display
Laser dicing applications

LED process solutions

Ultrasonic dicing

Processing of difficult-to-cut materials

Wafer thinning applications

TAIKO process

TSV
Contact
Your comments and questions are welcome.
Please click here to contact us.
News Releases

Inverstor Information
Personal Information Protection Policy
User Agreement
Contact
Back To Top