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Stealth dicing |
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Ablation processing |
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Laser processing of non-silicon materials such as SiC, glass and sapphire |
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Exhibit of thinning wheels and thinned wafers |
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Introduction of the latest DBG process information |
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Introduction to tape cutting applications |
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Introducing the relationship between DISCO’s technology and TSV/BSI process |
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Exhibit of TSV sample wafers |
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LED process solutions |
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TAIKO process |
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Sic wafer grinding and polishing processes |
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Dicing saw lineup |
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Dicing blade lineup |
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Flattening of LED prosperous resin |
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Bump flattening |
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Ultrasonic wave dicing |
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Ultrasonic wave grinding |
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Recycling of deionized dicing drain water |
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Other exhibits related to energy conservation products and related technology |
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We can accept any consultation for cutting and grinding consignment processing. |
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