- Latest stealth dicing technology
- Latest ablation processing technologies
- Laser processing of non-silicon materials such as sapphire, glass and GaN
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- Introduction to SiC wafer processing
- Ultrasonic-wave dicing sample exhibit
- TAIKO wafer exhibit
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- Thinned wafers and thinning wheels exhibit
- Introduction to the latest DBG process
- Resin grinding wheels and ground wafer exhibit
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- BG tape surface planarization sample exhibit
- LED phosphor resin planarization sample exhibit
- Bump planarization sample exhibit
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- Ultrasonic-wave dicing
- Ultrasonic-wave Charging Unit
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- Dicing saw lineup
- Dicing blade lineup
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- Feel free to ask us about our dicing and grinding service.
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Note: Please note that the exhibits may change without notice.
