Japanese Chinese Traditional Chinese Simplified Korean English
About DISCO Investors CSR
HomeNews ReleasesSolutionsProduct InformationCustomer SupportCustomer SatisfactionContact
DISCO HOME > Solutions > Applications Example > Dicing


Applications Example

Thick Wafer Dicing Using Blade Dicing Saws
Though blade dicing saws are generally used to singulate wafers, they are also able to process thick substrates when installed with a user-specified specification.

Processing Example
The following is a photograph of 60 mm deep grooving into a soda-lime glass block using a blade dicing saw.
DISCO responds to customers’ varied needs with customized solutions by utilizing the manufacturing technology of its equipment and consumables.

Sample Size(WxDxT) :40x15x70 mm
Cutting Depth : 60 mm


Kiru, Kezuru, Migaku Topics
Applications Example
DISCO Technical Review
Solutions Support

KABRA Used semiconductor equipment
Personal Information Protection Policy
User Agreement
Use of the DISCO Corporate Name
Guarantee policy for customer using DISCO Products
Back To Top