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DISCO HOME > Solutions > Applications Example > Dicing

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Applications Example


Thick Wafer Dicing Using Blade Dicing Saws
 
Though blade dicing saws are generally used to singulate wafers, they are also able to process thick substrates when installed with a user-specified specification.


Processing Example
The following is a photograph of 60 mm deep grooving into a soda-lime glass block using a blade dicing saw.
DISCO responds to customers’ varied needs with customized solutions by utilizing the manufacturing technology of its equipment and consumables.


溝入れ加工サンプル
Sample Size(WxDxT) :40x15x70 mm
Cutting Depth : 60 mm


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