Solutions

Applications Example

Thickness control by using NCG

NCG is The Non Contact Gauge.

DISCO's Fully Automatic Grinder and Grinder/Polisher usually measure wafer thickness in grinding process and control wafer thickness by contact gauge. NCG measure wafer thickness without contact, and has advantage below.

	<Avoidance wafer breakage risk by the thickness measurement>
		NCG avoid the risk of breaking wafer which is weak in load, for example the cavity configuration or a wafer ultrathinning. In the case of grinding such wafers, measuring thickness by the contact gauge itself makes risk of braking by the contact gauge.

	<Good evaluation of thickness variation between wafers>
		Because NCG measure only the Silicon thickness, it is possible to decrease Silicon thickness variation, caused by the tape differences or the thickness variation of a hard substrate.