We are introducing a grinding method, which grinds the ring section of a wafer, in the TAIKO process. When mounting a TAIKO wafer onto dicing tape, if the height difference between the ring section and TAIKO section is big, a large bubble is generated between the tape and wafer, which has a negative impact on the dicing. The ring grinding minimizes this height difference, so that it provides a better condition for affixing to the tape and higher quality of dicing.
