The Z05 Series electroformed bond blades employ new DISCO advances in materials and manufacturing process. The result of two types of ultra-high-performance blades handles hard and brittle materials, resin circuit boards and many semiconductor device packages.
Up to 6 concentration levels provide a greater blade selection.
In processing hard and brittle materials, process quality is improved while blade life is maintained.
Blade edge retains shape for stable and consistent processing.
Burring of metal and plastic may be prevented or reduced.
For the detailed specification and functions, view our catalogues.