Event Schedule

SEMICON WEST HYBRID

The highlights

  • Machine: DAD3221
  • Laser Processing
  • SiC Solution
  • Wafer Thinning processing
  • Power Device Processing
SEMICON Southeast Asia 2022

The highlights

  • Consumable (Hub Blade, Hubless Blade, Wheel, Dry Polish)
  • KKM for Packaging process
  • Laser Processing
  • Wafer Thinning processing
  • SiC Solution
Laser World of Photonics

The highlights

  • KABRA
  • LLO
  • LEAF
  • SD
  • Laser grooving and plasma dicing
  • SiC solution
  • Consultation for KKM Service
SEMICON Korea 2022

The highlights

  • Machine: DWR1722
  • Consumable (Hub Blade, Hubless Blade, Wheel, Dry Polish)
  • Narrow Street Solution (MUSUBI, SDBG, DBG etc)
  • Laser Processing(Ablation , Stealth dicing)
  • Advanced Package Processing
  • SiC Solution

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