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DISCO Technical Review

This webpage contains technical reviews and articles on Kiru, Kezuru, and Migaku technologies.
Jan 11, 2019Investigation of Cu and Ni Diffusion Amounts for Silicon Substrates(554KB)TR18-02
Jan 11, 2019Investigation of particles in the dicing saw usage environment(331KB)TR18-01
Jun 10, 2016Definition of Class 1 required for laser equipment and its importance(638KB)TR16-10
Jun 10, 2016The effects of edge trimming(101KB)TR16-09
Jun 10, 2016Usefulness of the ultra-compact deionized water recycling unit for dicing saws(100KB)TR16-07
Jun 10, 2016Wafer ultra-thinning process for 3D stacked devices and the influences on the device characteristics(402KB)TR16-06
Jun 10, 2016Dicing technologies for SiC(365KB)TR16-05
Jun 10, 2016Stealth laser dicing engine lineup(489KB)TR16-04
Jun 10, 2016Silicon wafer thinning, the singulation process, and die strength(446KB)TR16-03
Jun 10, 2016Wafer ESD in dicing saws and the effect of the countermeasures(158KB)TR16-02
Jun 10, 2016Thermal effect of stealth laser dicing(812KB)TR16-01

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