Blade Dicing

Basic Processes Using Blade Dicing Saws

This is a list of processes that can be performed using the standard functions in blade dicing saws.

User-specified Processes Using Blade Dicing Saws

This is a list of processes that can be performed by installing the user-specified specifications.

Dicing Thin Wafers

In recent years, with the increased adoption of IC cards, RFID tags, and SIP (system in package) for cellular phones and other mobile products, the market for finished semiconductor die 50 µm thick or less has grown rapidly. This high demand has in turn made the processing of thin wafers an essential competence for many device manufacturers. To provide the processing results that these companies require, DISCO continuously researches and develops the machines, blades, and applications that make thin wafer dicing a reality.

Blade Height Control Function

In some dicing applications, cut depth (= blade height) needs to be controlled with high precision. This blade height control function can be implemented by adding a height sensor to the dicing saw. Two representative examples of this function in wafer dicing and packaging are as follows.

QFN Package Processing

In the past, the processing of QFN (Quad Flat No-Lead) packages was performed with routers and other machine tools, but now that smaller and more varied packages are common, the use of a dicing saw has become more and more popular. DISCO's dicing saws can offer higher singulation throughput and productivity as well as less copper burring, while DISCO's new resinoid blade for package singulation can significantly improve process quality.

Debris and Particle Removal

CCD and CMOS image sensors, now quite common in digital cameras and mobile phones, are extremely sensitive to particles. Further, the adhesion of debris to IC bonding pads can result in bonding failure. DISCO handles potentially harmful particles and debris with a variety of machine features and applications.