Product lineup
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Dicing saws are machines that use blades to cut workpieces made of materials such as silicon, glass, and ceramics with high precision. Generally called a "slicer."
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Laser saws are machines that use laser light characteristics to achieve a high-speed, high-quality, precision processing. There are two major processing methods: Ablation and stealth dicing.
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Grinders are machines that thin or flatten materials while polishers are machines that polish materials to relieve stress or achieve mirrored surfaces.
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Surface planers are machines that use diamond bits to achieve high-precision flattening of materials. It is suitable for processing ductile materials such as Cu, solder, and resins.
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Die separators are machines that separate workpieces with high-precision after laser stealth dicing or DAF (Die Attach Film), which is indispensable for stacking thin chips.
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Wafer mounters are machines with an all-in-one mechanism, which enables UV irradiation on surface protection tapes, DAF（Die Attach Film） attachment, dicing frame mounting, and surface protection tape delamination.
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Waterjet saws are machines that cut workpieces with abrasive materials discharged from a nozzle together with pressurized water. It is suitable for curve cutting and heat-sensitive materials.
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Introduction to peripheral equipment that is used together with dicing saws and grinders to achieve more precise and stable processing results.
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Dicing blades are consumables used on dicing saws to cut or groove a variety of workpieces including silicon wafers.
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Grinding wheels are consumables used on grinders to thin or flatten a variety of workpieces including silicon wafers.
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Dry polishing wheels are consumables used on polishers to improve the durability of wafers by removing damaged layers (stress relief) after backgrinding.
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Introduction to wheel coolant additives that can improve processing quality and related products (various cassettes, frames, etc.) necessary for using precision processing equipment.
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Cut-off wheels are consumable used to cut a variety of materials such as special steel, ceramics, glass, etc.
Manufacturing process
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DBG
Dicing Before Grinding
Process in which thinning and die separation are performed simultaneously by first conducting grooving on the wafer using a dicing saw and then backgrinding
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SDBG
Stealth Dicing Before Grinding
Process that forms high-strength, thin die through backgrinding and tape expansion after the SD layer is formed in the wafer
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Low-K dicing
Process that dices wafers that include low-K material with low mechanical strength used as insulating film for LSI devices
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Surface planner
Process that planarizes ductile materials, such as metal and resin, using a diamond bit
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Ultrasonic dicing
Singulation process with high processing performance that adds ultrasonic vibration to the standard blade dicing process
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Stealth Dicing
Process that forms an SD layer using a focused laser beam and separates die using tape expansion
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TAIKO®
Process that improves handling for thin wafers without using secondary materials by leaving the edge and only backgrinding the inner section of the wafer
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KABRA
Process that slices wafers by forming a separation layer using laser irradiation from the front side of the SiC ingot
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