UPH is improved by approx. 30% through increased maximum X-axis speed and acceleration in addition to reduced wafer transfer and alignment times.
DFL7362 is compatible with a wide range of options related to quality and productivity, such as wafer thickness measurement and non-stop kerf check.
|Processing method||-||Stealth Dicing™|
|Max. workpiece size||mm||Φ300|
|Moving speed||mm/s||0.1 ～ 2,000|
|Max. rotating angle||deg||380|
|Machine dimensions (W×D×H)||mm||1,600 × 2,755 × 1,800|
|Machine weight||kg||Approx. 2,850|
*Product appearance, features, specifications, and other details may change due to technical
*Please read the standard specification sheet thoroughly before use.